机械合金化钛、锡、碳混合粉体中锡晶须的形成机理
Formation Mechanism of Sn Whiskers in Mechanical Alloying MixedPowder of Ti, Sn, C
摘 要
将质量比为2：1：1的钛粉、锡粉和碳粉混合，在高能球磨机中进行机械合金化，再进行室温时效处理，研究了机械合金化粉体中锡晶须的物相组成、微观结构及形成机理。结果表明：经机械合金化和室温时效处理后，混合粉体中出现絮状物，絮状物由锡晶须组成；锡晶须为体心正方结构β-Sn单晶体，呈柱状、丘状或结节状、纽结或弯折状和针状，直径约为100 nm，晶带轴为β-Sn的[011]晶带轴；在机械合金化产生的热量和巨大应力作用下，锡发生再结晶定向生长形成锡晶须。
锡晶须
微观结构
形成机理
mechanical alloying
Sn whisker
microstructure
formation mechanism
Abstract
The mixture of Ti powder, Sn powder and C powder with mass ratio of 2:1:1 was mechanically alloyed in a simoloyer mill, and then was treated by aging at room temperature. The phase composition, microstructure and formation mechanism of Sn whiskers in the mechanical alloying powder were studied. The results show that flocs appeared in the power mixture after mechanical alloying and aging at room temperature, and were composed of Sn whiskers. The Sn whiskers were columnar, collicular-shaped or nodular, knotted or curved, and needle-shaped single crystal β-Sn with body centered tetragonal structure. The whisker had a diameter of about 100 nm, and the zone axis was[011] zone axis of β-Sn. Under heat and huge stresses produced by mechanical alloying, the recrystallization and direct growth of Sn occurred, and then Sn whiskers were obtained.
中图分类号 TG146 DOI 10.11973/jxgccl202103010
所属栏目 材料性能及应用
基金项目 吉林省科技发展计划基金资助项目（20180201077GX）
收稿日期 2020/3/15
修改稿日期 2020/11/20
网络出版日期
作者单位点击查看
备注鲁海龙(1976-),男,吉林吉林人,副教授,硕士
引用该论文: LU Hailong. Formation Mechanism of Sn Whiskers in Mechanical Alloying MixedPowder of Ti, Sn, C[J]. Materials for mechancial engineering, 2021, 45(3): 52～55
鲁海龙. 机械合金化钛、锡、碳混合粉体中锡晶须的形成机理[J]. 机械工程材料, 2021, 45(3): 52～55
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参考文献
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【2】LIU M, XIAN A P. TEM observation of tin whisker[J]. Science China Technological Sciences,2011,54(6):1546-1550.
【3】ESHELBY J D. A tentative theory of metallic whisker growth[J]. Physical Review, 1953, 91(3):755-756.
【4】FRANK F C. On tin whiskers[J]. Philosophical Magazine, 1953,44:854-860.
【5】XU C, ZHANG Y, FAN C, et al. Understanding whisker phenomenon:The driving force for whisker formation[C]//National Symposium on Electronic Electroplating. Beijing:Electronic Manufacturing and Packaging Technology Branch of China Electronics Society, 2003.
【6】ARNOLD S M. The growth of metal whiskers on electrical components[C]//IEEE Electronic Components Conference.Philadelphia, PA:[s.n.], 1959:75-82.
【7】FISHER R M, DARKEN L S, CARROLL K G. Accelerated growth of tin whiskers[J]. Acta Metallurgica, 1954, 2(3):368-373.
【8】ARNOLD S M. Repressing the growth of tin whiskers[J]. Plating, 1966,53(1):96-99.
【9】谢明立,储凯,付键. 镍-磷合金化学镀镀层成分及时效处理温度对镀层组织性能的影响[J].表面技术,1998,27(2):18-19. XIE M L, ZHU K, FU J. Effects of composition and aging treatment temperature on microstructure and properties of nickel-phosphorus alloy electroless plating[J]. Surface Technology,1998,27(2):18-19.
【10】CHEN K M, WILCOX G D. Observations of the spontaneous growth of tin whiskers on tin-manganese alloy electrodeposits[J]. Physical Review Letters, 2005, 94(6):066104.
【11】SHI H C, XIAN A P. Tin whisker growth on NdSn3 powder[J]. Journal of Electronic Materials, 2011, 40(9):1962-1966.
【12】DUDEK M A, CHAWLA N. Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders[J]. Acta Materialia, 2009, 57(15):4588-4599.
【13】江波. 无铅镀层中锡晶须生长行为及机制的研究[D]. 沈阳:中国科学院金属研究所, 2007. JIANG B. Tin whisker growth behaviors and mechanism in lead-free coating[D]. Shenyang:Institute of Metal Research, Chinese Academy of Science, 2007.
【14】石红昌,冼爱平.镀层表面锡晶须自发生长现象的研究进展[J].中国有色金属学报,2011,21(5):1021-1030. SHI H C, XIAN A P. Research development of tin whisker spontaneous growth on plating surface[J]. The Chinese Journal of Nonferrous Metals,2011,21(5):1021-1030.
【15】TU K N, LI J C M. Spontaneous whisker growth on lead-free solder finishes[J]. Materials Science and Engineering:A, 2005,409(1/2):131-139.
【16】KIM K S, YU C H, YANG J M. Tin whisker formation of lead-free plated lead-frames[J]. Microelectronics Reliability, 2006, 46(7):1080-1086.
【17】WHITLAW K, EGLI A, TOBEN M. Preventing whiskers in electrodeposited tin for semiconductor lead frame applications[J]. Circuit World, 2004, 30(2):20-24.
【18】DIMITROVSKA A, KOVACEVIC R. Mitigation of Sn whisker growth by composite Ni/Sn plating[J]. Journal of Electronic Materials, 2009, 38(12):2516-2524.
【19】曾华梁, 吴仲达, 陈钧武. 电镀工艺手册[M].北京:机械工业出版社, 1997:152-169. ZENG H L, WU Z D, CHEN J W. Handbook of plating processing[M].Beijing:China Machine Press,1997:152-169.
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