环氧树脂灌封结构热力耦合特性研究
Study of Thermal-Mechanical Coupling Characteristics of Epoxy Resin Potting Structure
摘 要
对固化温度为60 ℃的环氧树脂灌封材料在-30~60 ℃环境温度下的力学和物性参数以及固化残余应变进行测试，并以此为输入条件，采用有限元模型对环氧树脂灌封结构的热应变进行模拟，并与试验结果进行对比，研究了环氧树脂灌封结构的热力耦合特性。结果表明：该环氧树脂灌封结构的仿真热应变和试验热应变的相对误差均在工程允许范围内，有限元模拟结果较准确；在-30~60 ℃范围内产生的热应力远小于其断裂强度，在该温度范围内不会因热应力而开裂。
有限元分析
热力耦合
残余应变
热应变
epoxy resin casting structure
finite element analysis
thermal-mechanical coupling
residual strain
thermal strain
Abstract
Mechanical and physical parameters and curing residual strain of epoxy resin potting material with curing temperature of 60℃ were tested at environmental temperatures of -30-60℃. Taking it as an input condition, the thermal strain of the epoxy resin potting structure was simulated by the finite element simulation, and the results were compared with the test results, and the thermal coupling characteristics of the epoxy resin potting structures were studied. The results show that the relative errors of the simulated thermal strain and the experimental thermal strain of the epoxy resin potting structure were both within the allowable range of the project, the finite element simulation results was accurate. The thermal stress in the range of -30-60℃ was far less than its fracture strength, and it would not crack due to thermal stress in the range of temperature.
中图分类号 TB332 DOI 10.11973/jxgccl202103013
所属栏目 物理模拟与数值模拟
基金项目 国家自然科学基金资助项目（51604251）
收稿日期 2019/12/10
修改稿日期 2020/10/27
网络出版日期
作者单位点击查看
备注张国亮(1976-),男,陕西汉中人,副研究员,博士
引用该论文: ZHANG Guoliang,LI Yuefang,LI Xiang. Study of Thermal-Mechanical Coupling Characteristics of Epoxy Resin Potting Structure[J]. Materials for mechancial engineering, 2021, 45(3): 66～70
张国亮,李悦芳,李想. 环氧树脂灌封结构热力耦合特性研究[J]. 机械工程材料, 2021, 45(3): 66～70
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