研究了不同钇含量（质量分数分别为0，0.003 9%，0.021%，0.053%，0.15%） B10白铜合金在不同退火温度（200~800℃）下的显微组织和硬度，分析了钇对合金再结晶行为的影响。结果表明：350~650℃退火时B10合金处于再结晶初期，650~800℃退火时处于再结晶后期；再结晶初期，钇主要影响再结晶形核，钇质量分数小于0.003 9%时，钇不利于再结晶形核，超过0.003 9%时，钇明显促进再结晶形核，且相同温度下，钇质量分数为0.003 9%时合金的硬度最高，0.15%时的硬度最低；再结晶后期，钇能抑制再结晶晶粒长大，钇含量越高，其复合夹杂物越多，尺寸越大，对晶界的钉扎力越大，晶粒越细小，此阶段随着退火温度升高，硬度急剧下降，且温度为800℃时，钇质量分数为0.15%合金的硬度最大，其他钇含量下的硬度则基本相等。

The microstructure and hardness of B10 white copper alloy with different Y content (0,0.003 9wt%,0.021wt%,0.053wt%,0.15wt%) after annealing at different temperatures (200-800 ℃) were studied, and the effect of Y on recrystallization behavior was analyzed. The results show that B10 alloy was in the early stage of recrystallization in annealing at 350-650 ℃, and was in the later stage of recrystallization in annealing at 650-800 ℃. In the early stage of recrystallization, Y mainly affected the nucleation of recrystallization. When the content of Y was less than 0.003 9wt%, Y was not conducive to recrystallization nucleation. When the content of Y was more than 0.003 9wt%, Y promoted recrystallization nucleation obviously. At the same temperature, the hardness of the alloy was the highest when the content of Y was 0.003 9wt%, and was the lowest when the content of Y was 0.150 0wt%. In the later stage of recrystallization, Y could suppress the growth of recrystallization grains. The higher content of Y, the more the number of the composite inclusions, the larger the inclusion size, the higher the pinning force acting on grain boundaries, and the finer the grains. At this stage, the hardness decreased sharply with increasing annealing temperature. The hardness of the alloy with 0.15wt% Y was the highest after annealing at 800 ℃, while the hardness of other alloys was basically the same.