Growth of Homogeneous and Heterogeneous Structural Pure Copper Grains During Annealing Process
摘 要
通过相场模型和理想晶粒生长模型,模拟了均质结构及异质结构(梯度结构和双峰结构)纯铜在退火过程中的晶粒生长。结果表明:晶界能垒变化对均质结构晶粒生长速率的影响较小;退火时间大于600 s时,均质结构晶粒的生长速率有一个较大的阶梯性变化;对于异质结构晶粒,晶界能垒越大,晶粒生长越慢;梯度结构中,小晶粒的生长速率最快,中晶粒的次之,大晶粒的最慢,且晶粒尺寸越大,晶界能垒对生长速率的影响越小;双峰结构中,晶界能垒对粗晶生长速率的影响较细晶的大,增加粗晶数目,细晶的生长速率明显降低,粗晶的生长速率增加。
Abstract
The grain growth during the annealing process of pure copper with homogeneous and heterogeneous structure (gradient structure and bimodal structure) were simulated by the phase field model and the ideal grain growth model. The results show that the change of grain boundary energy barrier had little effect on the growth rate of grain with homogeneous structure. When the annealing time was longer than 600 s, the growth rate of homogeneous structural grains had a larger step change. For heterostructural grains, the greater the grain boundary energy barrier, the slower the grain growth. In the gradient structure, the growth rate of small grains was the fastest, followed by that of medium grains, and that of large grains was the slowest. The larger the grain size, the smaller the influence of the grain boundary energy barrier on the growth rate. In the bimodal structure, the grain boundary energy barrier had greater influence on the growth rate of coarse grains than the fine grains. The growth rate of fine grains significantly decreased and of coarse grains increased after increasing number of coarse grains.
中图分类号 TG111 DOI 10.11973/jxgccl202106011
所属栏目 物理模拟与数值模拟
基金项目 国家自然科学基金资助项目(51725503;51805501;52005186)
收稿日期 2020/4/7
修改稿日期 2020/12/30
网络出版日期
作者单位点击查看
备注孙书琪(1995-),男,安徽池州人,硕士研究生
引用该论文: SUN Shuqi,WANG Runzi,YUAN Guangjian,CHEN Hao,GAO Jianbao,PENG Wei,ZHANG Xiancheng,ZHANG Lijun. Growth of Homogeneous and Heterogeneous Structural Pure Copper Grains During Annealing Process[J]. Materials for mechancial engineering, 2021, 45(6): 62~69
孙书琪,王润梓,苑光健,陈浩,高建宝,彭威,张显程,张利军. 退火过程中均质和异质结构纯铜晶粒的生长[J]. 机械工程材料, 2021, 45(6): 62~69
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【3】卢柯.梯度纳米结构材料[J].金属学报,2015,51(1):1-10. LU K. Gradient nanostructured materials[J].Acta Metallurgica Sinica, 2015,51(1):1-10.
【4】周瑜,朱和国.合金元素增强高熵合金结构和性能的研究综述[J].热加工工艺,2018,47(6):36-40. ZHOU Y, ZHU H G. Research review of structure and properties of high-entropy alloys reinforced by alloying elements[J].Hot Working Technology,2018,47(6):36-40.
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【6】WU X L,ZHU Y T.Heterogeneous materials:A new class of materials with unprecedented mechanical properties[J].Materials Research Letters,2017,5(8):527-532.
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【14】ZHANG Y S,ZHANG X M,BAI X F,et al.Effect of thermal annealing on microstructure and mechanical properties of a gradient structured tantalum prepared by plasma activated sintering[J].International Journal of Refractory Metals and Hard Materials,2012,30(1):1-5.
【15】BACH J,STOIBER M,SCHINDLER L,et al.Deformation mechanisms and strain rate sensitivity of bimodal and ultrafine-grained copper[J].Acta Materialia,2020,186:363-373.
【16】HE J H,JIN L,WANG F H,et al.Mechanical properties of Mg-8Gd-3Y-0.5Zr alloy with bimodal grain size distributions[J].Journal of Magnesium and Alloys,2017,5(4):423-429.
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【19】KAZARYAN A,WANG Y,DREGIA S A,et al.Grain growth in systems with anisotropic boundary mobility:Analytical model and computer simulation[J].Physical Review B,2001,63(18):184102.
【20】KRILL Ⅲ C E,CHEN L Q.Computer simulation of 3-D grain growth using a phase-field model[J].Acta Materialia,2002,50(12):3059-3075.
【21】WU K A,VOORHEES P W.Phase field crystal simulations of nanocrystalline grain growth in two dimensions[J].Acta Materialia,2012,60(1):407-419.
【22】MIYOSHI E,TAKAKI T,OHNO M,et al.Ultra-large-scale phase-field simulation study of ideal grain growth[J].NPJ Computational Materials,2017,3(1):1-6.
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【24】MOELANS N, BLANPAIN B, WOLLANTS P. Quantitative analysis of grain boundary properties in a generalized phase field model for grain growth in anisotropic systems[J]. Physical Review B, 2008, 78(2):024113.
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【27】ÍŽEK J,PROCHÁZKA I,CIESLAR M,et al.Thermal stability of ultrafine grained copper[J].Physical Review B,2002,65(9):094106.
【28】SENECHAL M. Spatial tessellations:Concepts and applications of voronoi diagrams[J]. Science, 1993, 260(5111):1170-1173.
【29】WANG Z B,LU K,WILDE G,et al.Effects of grain growth on interface diffusion in nanostructured Cu[J].Scripta Materialia,2011,64(11):1055-1058.
【30】罗志荣,卢成健,高英俊.相场法研究初始微结构对晶粒长大的影响[J].广西科学,2016,23(5):432-436. LUO Z R, LU C J, GAO Y J. Phase field study on effect of initial microstructure on grain growth[J].Guangxi Sciences,2016,23(5):432-436.
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【34】GUO N,LI D R,YU H B,et al.Annealing behavior of gradient structured copper and its effect on mechanical properties[J].Materials Science and Engineering:A,2017,702:331-342.
【35】WU Y,LUO Q,QIN E W.Influencing factors of abnormal grain growth in Mg alloy by phase field method[J].Materials Today Communications,2020,22:100790.
【36】ZIELINSKI E M,VINCI R P,BRAVMAN J C.Effects of barrier layer and annealing on abnormal grain growth in copper thin films[J].Journal of Applied Physics,1994,76(8):4516-4523.
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