贵金属溅射靶材的研究进展
Research Progress on Precious Metal Sputtering Target
摘 要
溅射靶材是磁控溅射制备薄膜的关键原材料，其质量决定着溅射薄膜的性能。贵金属溅射靶材因具有优异的物理和化学性能而广泛应用于高性能薄膜的制备。综述了贵金属溅射靶材制备方法、技术要求和应用情况的研究进展，指出高纯化、大尺寸、高利用率以及靶材生产与溅射镀膜一体化是贵金属靶材未来发展方向。
溅射靶材
薄膜
制备方法
应用
precious metal
sputtering target
thin film
preparation method
application
Abstract
Sputtering targets are the key raw materials for the preparation of thin films by magnetron sputtering, and their quality determines the performance of the sputtered thin films. Precious metal sputtering targets are widely used in the preparation of high-performance thin films because of their excellent physical and chemical properties. The research progress on the preparation methods, technical requirements and application of precious metal sputtering targets is reviewed. The development direction of high purity, large size, high utilization rate, and integrated development of target production and sputtering film is put forward.
中图分类号 TG146.3 DOI 10.11973/jxgccl202108002
所属栏目 综述
基金项目 国家重点研发计划项目（2017YFB0305503）；云南省国际合作计划项目（2014IA037）；云南省创新团队项目（2019HC024）
收稿日期 2021/1/18
修改稿日期 2021/7/9
网络出版日期
作者单位点击查看
备注许彦亭(1992-),女,云南昭通人,工程师,硕士
引用该论文: XU Yanting,GUO Junmei,WANG Chuanjun,SHEN Yue,GUAN Weiming,WEN Ming. Research Progress on Precious Metal Sputtering Target[J]. Materials for mechancial engineering, 2021, 45(8): 8～14
许彦亭,郭俊梅,王传军,沈月,管伟明,闻明. 贵金属溅射靶材的研究进展[J]. 机械工程材料, 2021, 45(8): 8～14
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参考文献
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【3】孙振华,沈丽如.提高平面磁控溅射靶材利用率方法分析[J].真空,2016,53(4):11-13. SUN Z H,SHEN L R.Analysis of improving the utilization rate of sputtering target of planar magnetic[J].Vacuum,2016,53(4):11-13.
【4】张卫刚,李媛媛,孙旭东,等.平板显示行业用金属溅射靶材的市场需求分析[J].真空科学与技术学报,2018,38(9):821-824. ZHANG W G,LI Y Y,SUN X D,et al.Analysis of market demand and supply of sputtering target in flat-panel display industry[J].Chinese Journal of Vacuum Science and Technology,2018,38(9):821-824.
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【10】贾国斌,冯寅楠,贾英.磁控溅射用难熔金属靶材制作、应用与发展[J].金属功能材料,2016,23(6):48-52. JIA G B,FENG Y N,JIA Y.Manufacture,application and development of refractorymetal target used on magnetron sputtering[J].Metallic Functional Materials,2016,23(6):48-52.
【11】邓瑞,闻明,陈家林,等.钌粉提纯和钌靶制备的研究进展[J].贵金属,2019,40(1):82-87. DENG R,WEN M,CHEN J L,et al.Progress in refining of ruthenium powder and preparation of ruthenium target[J].Precious Metals,2019,40(1):82-87.
【12】何金江,万小勇,周辰,等.半导体用高利用率长寿命溅射靶材的研制[J].半导体技术,2014,39(1):71-77. HE J J,WAN X Y,ZHOU C,et al.Research and preparation of high utilization rate and long-life sputtering target used in semiconductor[J].Semiconductor Technology,2014,39(1):71-77.
【13】TEPMAN A. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity:US5320728[P].1994-6-14.
【14】杨邦朝,胡永达,崔红玲.溅射靶材的应用及发展趋势[J].真空,2002,39(1):1-4. YANG B C,HU Y D,CUI H L.Trend in development and applications of sputtering target materials[J].Vacuum,2002,39(1):1-4.
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【16】张卫刚,李媛媛,孙旭东,等.半导体芯片行业用金属溅射靶材市场分析[J].世界有色金属,2018(10):1-3. ZHANG W G,LI Y Y,SUN X D,et al.Market analysis of metal sputtering target materials used in semiconductor chip industry[J].World Nonferrous Metals,2018(10):1-3.
【17】刘树峰,刘思德.等离子喷涂技术在溅射靶材制备中的应用[J].稀土信息,2018(4):32-35. LIU S F,LIU S D.Application of plasma spraying technology in the preparation of sputtering target[J].Rare Earth Information,2018(4):32-35.
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【19】范亮,王欣平,董亭义.硬盘磁记录材料及其靶材制备技术[C]//第七届中国功能材料及其应用学术会议论文集.长沙:[出版者不详],2010:361-363. FAN L, WANG X P, DONG T Y. Hard disk magnetic recording materials and target preparation technology[C]//Proceedings of the 7th China Conference on Functional Materials and Applications. Changsha:[s.n.],2010:361-363.
【20】王一晴,闻明,郭俊梅,等.半导体工业用镍铂合金靶材的制备及结构研究[J].贵金属,2015,36(4):27-31. WANG Y Q,WEN M,GUO J M,et al.Preparation and structure of NiPt alloy target used in semiconductor industry[J].Precious Metals,2015,36(4):27-31.
【21】金永中,刘东亮,陈建.溅射靶材的制备及应用研究[J].四川理工学院学报(自然科学版),2005,18(3):22-24. JIN Y Z,LIU D L,CHEN J.Studying on manufacture and application of sputtering target materials[J].Journal of Sichuan University of Science & Engineering (Natural Science Edition),2005,18(3):22-24.
【22】李骥.RuTi基单层薄膜作为铜互连扩散阻挡层研究[D].上海:复旦大学,2010. LI J.Research on RuTi-based single-layer film as copper interconnection diffusion barrier[D].Shanghai:Fudan University,2010.
【23】陈松,耿永红,王传军,等.磁控溅射用CoCrPt系靶材制备技术研究进展[J].贵金属,2013,34(1):74-78. CHEN S,GENG Y H,WANG C J,et al.Research progress of CoCrPt system targets fabrication[J].Precious Metals,2013,34(1):74-78.
【24】张爱国,王荫君,韩秀峰,等.Cr/Ru/PtCo/Ru/PtCo/Ru介质中底层Ru厚度对磁记录特性影响的研究[J].物理学报,2005,54(4):1831-1835. ZHANG A G,WANG Y J,HAN X F,et al.Effect of thickness of the Ru under layer on the magneticrecording property of Cr/Ru/PtCo/Ru/PtCo/Ru media[J].Acta Physica Sinica,2005,54(4):1831-1835.
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