Sn-3.0Ag-0.5Cu/ENEPIG焊点界面反应及剪切性能的尺寸效应
Size Effect of Interfacial Reaction and Shear Performance of Sn-3.0Ag-0.5Cu/ENEPIG Solder Joint
摘 要
将直径分别为200，300，400 μm的Sn-3.0Ag-0.5Cu焊球在化学镍/钯/金（ENEPIG）焊盘上进行多次（1，3，5，7次）钎焊回流形成Sn-3.0Ag-0.5Cu/ENEPIG焊点，并对回流3次的焊点进行不同温度（75，100，125 ℃）的时效处理，研究了焊球尺寸对钎焊回流及时效处理后焊点界面组织及剪切强度的影响。结果表明：钎焊回流和时效处理后，焊点界面金属间化合物层的厚度及焊点的剪切强度均随焊球直径的增大而降低，二者表现出明显的尺寸效应；在焊球尺寸相同的条件下，回流次数的增加和时效温度的升高均会导致界面金属间化合物层厚度的增加，以及焊点剪切强度的降低。
回流
尺寸效应
金属间化合物
剪切强度
Sn-3.0Ag-0.5Cu/ENEPIG soler joint
reflow
size effect
intermetallic compound
shear strength
Abstract
Sn-3.0Ag-0.5Cu solder balls with diameters of 200, 300,400 μm were reflowed on electroless nickel electroless palladium immersion gold (ENEPIG) pads for 1, 3, 5 and 7 times to form Sn-3.0Ag-0.5Cu/ENEPIG solder joints. The solder joints after 3-time reflow were subjected to aging treatment at different temperatures (75,100,125 ℃). The effect of the solder ball size on the interface microstructure and shear strength of the solder joints after reflow and aging was investigated. The results show that after reflow and aging treatment, the thickness of the interfacial intermetallic compound and the shear strength of the solder joints decreased with increasing solder ball diameter, showing obvious size effect. When the size of solder ball was the same, the increase of reflow time and aging temperature led to the increase of interfacial intermetallic compound thickness and the decrease of the shear strength of the solder joint.
中图分类号 TG115 DOI 10.11973/jxgccl202108015
所属栏目 材料性能及应用
基金项目 国家自然科学基金资助项目（U1732118，51675080）；中央高校基本科研业务费资助项目（DUT20JC46）；大学生创新项目（2019101410502010864）
收稿日期 2020/8/7
修改稿日期 2021/4/29
网络出版日期
作者单位点击查看
备注于凤云(1980－),女,辽宁本溪人,工程师,硕士
引用该论文: YU Fengyun,LIU Hao,DU Yanfeng. Size Effect of Interfacial Reaction and Shear Performance of Sn-3.0Ag-0.5Cu/ENEPIG Solder Joint[J]. Materials for mechancial engineering, 2021, 45(8): 81～86
于凤云,刘浩,杜彦凤. Sn-3.0Ag-0.5Cu/ENEPIG焊点界面反应及剪切性能的尺寸效应[J]. 机械工程材料, 2021, 45(8): 81～86
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参考文献
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【2】ISLAM M N,SHARIF A,CHAN Y C.Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging[J].Journal of Electronic Materials,2005,34(2):143-149.
【3】王斌,黄春跃,梁颖,等.微尺度BGA焊点拉伸过程有限元仿真分析[J].电子元件与材料,2014,33(7):82-86. WANG B,HUANG C Y,LIANG Y,et al.Finite element simulation analysis of stress and strain in miniature BGA solder joints under tensile load[J].Electronic Components & Materials,2014,33(7):82-86.
【4】HUANG M L,YANG F.Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate[J].Scientific Reports,2014,4:7117.
【5】WANG S B, YAO Y, LONG X. Critical review of size effects on microstructure and mechanical properties of solder joints for electronic packaging[J]. Applied Sciences, 2019, 9(2):227.
【6】FENG J Y, HANG C J, TIAN Y H, et al. Effect of electric current on grain orientation and mechanical properties of Cu-Sn intermetallic compounds joints[J]. Journal of Alloys and Compounds, 2018, 753(15):203-211.
【7】TIAN S,ZHOU J,XUE F,et al.Microstructure,interfacial reactions and mechanical properties of Co/Sn/Co and Cu/Sn/Cu joints produced by transient liquid phase bonding[J].Journal of Materials Science:Materials in Electronics,2018,29(19):16388-16400.
【8】WU W H,LIN C S,HUANG S H,et al.Influence of palladium thickness on the soldering reactions between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) surface finish[J].Journal of Electronic Materials,2010,39(11):2387-2396.
【9】LU C T, TSENG H W, CHANG C H, et al. Retardation of electromigration-induced Ni(P) consumption by an electroless Pd insertion layer[J]. Applied Physics Letters, 2010, 96(23):232103.
【10】HO C E,YANG S C,KAO C R.Interfacial reaction issues for lead-free electronic solders[J].Journal of Materials Science:Materials in Electronics,2007,18(1/2/3):155-174.
【11】LI X P,XIA J M,ZHOU M B,et al.Solder volume effects on the microstructure evolution and shear fracture behavior of ball grid array Structure Sn-3.0Ag-0.5Cu solder interconnects[J].Journal of Electronic Materials,2011,40(12):2425-2435.
【12】TIAN Y H, HANG C J, WANG C Q, et al. Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing[J]. Materials Science and Engineering:A, 2011, 529(25):468-478.
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