63Sn-37Pb和Sn-3Ag-0.5Cu合金钎料的扭转低周疲劳性能
Torsional Low Cycle Fatigue Properties of 63Sn-37Pb and Sn-3Ag-0.5Cu Alloy Solders
摘 要
用扭转疲劳试验机对63Sn-37Pb和Sn-3Ag-0.5Cu两种合金钎料在扭转载荷下的低周疲劳性能进行了研究。结果表明: 两种钎料均为循环软化材料, 它们的变形主要由塑性变形决定; 两种钎料的疲劳寿命均随着剪应变幅的减小而显著增大; 在相同的剪应变幅下, Sn-3Ag-0.5Cu合金钎料的疲劳寿命比63Sn-37Pb钎料的长, 即Sn-3Ag-0.5Cu合金钎料的抗剪切疲劳能力更强。
Sn-3Ag-0.5Cu合金
低周疲劳
扭转疲劳
疲劳寿命
63Sn-37Pb alloy
Sn-3Ag-0.5Cu alloy
low cycle fatigue
torsional fatigue
fatigue life
Abstract
The low cycle fatigue properties of 63Sn-37Pb and Sn-3Ag-0.5Cu alloy solders at torsional load were studied by torsional fatigue tester. The results show that the two solders are cyclic softening materials and their deformation is dominated by plastic deformation. The fatigue life of the alloy solders all increased with decreasing the shear strain amplitude. Moreover, the fatigue life of Sn-3Ag-0.5Cu solder was longer than that of 63Sn-37Pb solder at the same shear strain amplitude, indicating that the former had higher resistance to shear fatigue failure.
中图分类号 TG146.1
所属栏目 材料性能及其应用
基金项目
收稿日期 2013/6/22
修改稿日期 2014/4/15
网络出版日期
作者单位点击查看
备注郭洪强(1969-), 男, 山东淄博人, 副教授, 硕士。
引用该论文: GUO Hong-qiang. Torsional Low Cycle Fatigue Properties of 63Sn-37Pb and Sn-3Ag-0.5Cu Alloy Solders[J]. Materials for mechancial engineering, 2014, 38(8): 65～69
郭洪强. 63Sn-37Pb和Sn-3Ag-0.5Cu合金钎料的扭转低周疲劳性能[J]. 机械工程材料, 2014, 38(8): 65～69
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参考文献
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【14】KANCHANOMAI C, MIYASHITA Y, MUTOH Y. Low cycle fatigue behavior and mechanisms of a eutectic Sn-Pb solder 63Sn-37Pb［J］.International Journal of Fatigue,2002,24: 671-683.
【15】STOLKARTS V, KEER LM, FINE M E. Damage evolution governed by microcrack nucleation with application to the fatigue of 63Sn-37Pb solder［J］.Journal of the Mechanics and Physics of Solids,1999,47: 2451-2468.
【2】梁文杰, 彭红建.无铅钎料的研究开发现状［J］.材料导报, 2011, 25(4): 127-130.
【3】ABTEW M, SELVADURAY G. Lead-free solders in micro-electronics［J］.Materials Science and Engineering,2000,27: 95-141.
【4】PANG J H L, XIONG B S, LOW T H.Low cycle fatigue study of lead free 99.3Sn-0.7Cu solder alloy［J］.International Journal of Fatigue,2004,26: 865-872.
【5】PANG J H L, LOW T H,XIONG B S,et al.Thermal cycling aging effects on Sn-Ag-Cu solder joint microstrcture［J］.IMC and Strength Thin Solid Film,2004,462/463: 370-375.
【6】罗艳, 高庆, 杨显杰.63Sn-37Pb钎料合金耦合损伤时相关理论模型［J］.机械工程材料, 2008,32(11): 78-81.
【7】CHEN Gang, CHEN Xu, NIU Chang-dong. Uniaxial ratcheting behavior of 63Sn37Pb solder with loading histories and stress rates［J］.Materials Science and Engineering: A,2006,421: 238-244
【8】CHEN X,SONG J,KIM K S.Fatigue life of 63Sn-37Pb solder related to load drop under uniaxial torsional loading［J］.International Journal of Fatigue,2006,28: 767-776.
【9】BAI Ning, CHEN Xu. A new unified constitutive model with short- and long-range back stress for lead-free solders of Sn-3Ag-0.5Cu and Sn-0.7Cu［J］.International Journal of Plasticity,2009,25: 2181-2203.
【10】许天旱, 赵麦群, 刘新华, Sn-Ag-Cu系无铅焊锡成分的优化研究［J］.电子元件与材料, 2004(8): 14-16.
【11】MILLER K J,CHANDER D C.High strain torsion fatigue of solid and tubular specimens［J］.Proceedings of Institution of Mechanical Engineerings,1970,24: 262-270.
【12】PANG J H L,XIONG B S, LOW T H. Low cycle fatigue models for lead-free solders［J］.Thin Solid Films,2004,462/463: 408-412.
【13】ASTM E606 Standard practice for strain-controlled fatigue testing［S］.
【14】KANCHANOMAI C, MIYASHITA Y, MUTOH Y. Low cycle fatigue behavior and mechanisms of a eutectic Sn-Pb solder 63Sn-37Pb［J］.International Journal of Fatigue,2002,24: 671-683.
【15】STOLKARTS V, KEER LM, FINE M E. Damage evolution governed by microcrack nucleation with application to the fatigue of 63Sn-37Pb solder［J］.Journal of the Mechanics and Physics of Solids,1999,47: 2451-2468.
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