高体积分数SiCp增强6063Al基复合材料的真空加压钎焊
Vacuum Brazing with Pressure of High-Volume-Fraction SiCp Reinforced 6063 Al-based Composite
摘 要
在580 ℃、保温40 min、压力为4 kPa的钎焊条件下, 采用Al70-Cu22.3-Si6.1-Mg1.6膏状钎料对增强相体积分数为60%的SiCp/6063Al复合材料进行真空加压钎焊, 通过扫描电镜和剪切试验等研究了钎料对复合材料基体及SiC增强相的润湿机理以及钎焊接头的显微组织、剪切断口形貌。结果表明: 在试验条件下, 钎料对复合材料的润湿性较高, 可通过扩散及机械压渗作用与基体、SiC颗粒分别形成冶金结合和机械锁合, 接头的抗剪强度均值为71.6 MPa; 钎料与基体合金的反应界面消失, 钎料对大块SiC增强相的润湿性一般, 二者之间存在较小的间隙; 断裂发生在钎料层以及钎料与复合材料界面的母材侧。
SiCp/6063Al复合材料
真空加压钎焊
抗剪强度
润湿机理
Al70-Cu22.3-Si6.1-Mg1.6 solder paste
SiCp/6063Al composite
vacuum brazing with pressure
shear strength
wetting mechanism
Abstract
One soldering paste of aluminum based ball-grinding powders containing 22.3wt.%Cu, 6.1wt.%Si, 1.6wt.%Mg was used to brazing the 60vol.%SiCp/6063Al composite under the brazing condition of 580 ℃, holding for 40 min and pressure of 4 kPa. Via SEM and shearing test, the wetting mechanism of soldering paste on the composite matrix and SiC particles, and the shear fracture morphology and microstructure of soldered joints were investigated. The results reveal that this solder alloy had a good wettability to the composite, the average shear strength was 71.6 MPa because of forming metallurgical bonding and mechanical interlocking respectively by diffusion and mechanical penetration. What′s more, the interface between the solder and the matrix alloy disappeared, and the solder had common wetting on bigger SiC particles for some small gaps between them. The fracture surface indicated the fracture occurred inside the solder alloy and the base material side of the joining interface between the solder and the composite.
中图分类号 TG454
所属栏目 试验研究
基金项目 国家自然科学基金资助项目(51245008); 科技部中小型企业创新基金资助项目(11C26214105167)
收稿日期 2013/8/17
修改稿日期 2014/7/31
网络出版日期
作者单位点击查看
备注王鹏(1988-), 男, 河南商丘人, 硕士研究生。
引用该论文: WANG Peng,CHENG Dong-feng,NIU Ji-tai. Vacuum Brazing with Pressure of High-Volume-Fraction SiCp Reinforced 6063 Al-based Composite[J]. Materials for mechancial engineering, 2014, 38(9): 34～38
王鹏,程东锋,牛济泰. 高体积分数SiCp增强6063Al基复合材料的真空加压钎焊[J]. 机械工程材料, 2014, 38(9): 34～38
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参考文献
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【2】牛济泰,卢金斌,穆云超,等.SiCp/ZL101复合材料与可伐合金4J29钎焊的分析［J］.焊接学报,2010,31(5):37-40.
【3】徐峰.SiC增强铝基复合材料焊接特性及其储能焊［J］.轻合金加工技术,2010,48(4):48-51.
【4】LENG Xue-song, WANG Chang-wen, ZHANG Yang, et al. Strengthening mechanism of ceramic particle reinforced bonds by ultrasonic brazing of AlMMCs ［J］.Tranctions of Nonferrous Metals Society of China,2011,12:290-294.
【5】陈茂爱, 陆皓, 唐逸民.SiCp/LD2Al合金复合材料电弧焊的焊接性［J］.金属学报, 2000, 36(7): 770-774.
【6】LEI Yu-cheng, ZHANG Zhen, NIE Jia-jun, et al. Effect of Ti-Al on microstructures and mechanical properties of plasma arc in-situ welded joint of SiCp/Al MMCs ［J］.Transactions of Nonferrous Metals Society of China,2008,18(4):809-813.
【7】HAN Zong-jie, JU Jin-long, XUE Song-bai, et al. Microstructures of Sn-Ag-Cu lead-free soldered joints with diode-laser soldering ［J］.Journal of Central South University: Science and Technology,2006,37(2):229-234.
【8】李杏瑞, 牛济泰, 杨顺成. SiCp/6061铝基复合材料电阻电焊接头中的缺陷分析［J］.机械工程材料, 2013,37(4):14-16,21.
【9】季小辉, 王少刚, 董桂萍. SiCp/101Al复合材料电子束焊接接头温度场对其显微组织的影响［J］.机械工程材料, 2009,33(5):97-100.
【10】MAITYA J, PALB T K, MAITIC R. Transient liquid phase diffusion bonding of 6061-15wt% SiCp in argon environment ［J］.Journal of Materials Processing Technology,2009,209(7):3568-3580.
【11】张新平, 魏巍, 权高峰.SiCp增强Al基复合材料的真空扩散焊接［J］.金属学报, 1999, 35(2): 198-202.
【12】HUANG Ji-hua, DONG Yue-ling, WAN Yun, et al. Investigation on reactive diffusion bonding of SiCp/6063 MMC by using mixed powders as interlayers［J］.Journal of Materials Processing Technology,2007,190(1/3):312-316.
【13】ZHANG Yang, YAN Jiu-chun, CHEN Xiao-guang, et al. Ultrasonic dissolution of brazing of 55％SiCp/A356 composites［J］.Transactions of Nonferrous Metals Society of China,2010,20(5):746-750.
【14】NIU Ji-tai, LUO Xiang-wei, TIAN Hao, et al. Vacuum brazing of aluminum metal matrix composite (55vol.% SiCP/A356) using aluminum-based filler alloy ［J］.Materials Science and Engineering: B,2012,177(19):1707-1711.
【15】LU Jin-bin, MU Yun-chao, LUO Xiang-wei, et al. A new method for soldering particle-reinforced aluminum metal matrix ［J］.Materials Science and Engineering: B,2012,177(20):1759-1763.
【16】冯波,雷玉成,冯波.铝-钛-镍-硅合金填料对SiCp6061Al基复合材料等离子弧焊接接头组织与性能的影响［J］.机械工程材料, 2010,34(3):23-26.
【17】雷玉成,王志伟,冯波.电弧超声对SiCp/6061Al复合材料等离子弧焊缝组织与接头性能的改善性能［J］.机械工程材料, 2009,33(12):9-11,15.
【18】ALONSO A, PAMIES A, NARCISO J, et al. Evalution of the wettability of liquid aluminium with ceramic particulates(SiC, TiC, Al2O3)by means of pressure infiltration［J］.Metallurgical Transactions: A,1993,24(6):1423-1432.
【19】李杏瑞, 杨涤心, 肖宏滨. 碳化硅铝基复合材料的钎焊［J］.洛阳工学院学报, 2002,23(1):19-22.
【20】ZHANG Gui-fang, SU Wei, ZHANG Jian-xun, et al. Wetting behavior of a novel Al-Si-Ti active filler metal fiol on aluminium matrix composite［J］.Journal of Materials Engineering and Performance,2013,22(7):1982-1994.
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