时效对平面接触型铜/铝设备线夹组织结构及性能的影响
Influence of Artificial Aging on Microstructures and Properties of Plane Contact Type Cu/Al Terminal Connectors
摘 要
采用超声波浸锡-铅合金钎焊技术制备平面接触型铜/铝设备线夹。通过150 ℃长时间保温(直至720 h)的人工时效, 研究线夹在高温运行条件下的显微组织结构变化及其对线夹结合性能、电学性能产生的影响。结果表明: 时效导致线夹铜板与锡-铅合金钎料界面间形成由Cu6Sn5和Cu3Sn构成的金属间化合物(IMC)层, 同时在IMC层前沿的锡-铅钎料中形成富铅层。时效过程中, IMC层遵守抛物线生长规律, 生长系数k=3.5×10-17 m2/s。随着时效的进行, 线夹的剪切强度持续降低, 时效720 ℃后, 剪切强度下降近20%。线夹的断裂机制也由沿钎料内部的韧性断裂向沿富铅层的脆性断裂转变; 同时线夹的电阻率也明显升高。
人工时效
组织结构
剪切强度
电阻率
Cu/Al terminal connector
artificial aging
microstructure
shear strength
electrical resistivity
Abstract
Plane contact type Cu/Al terminal connectors were produced through an ultrasonic dip soldering technique. Microstructure evolution and its effect on the bonding strength and electrical property of the connectors were studied after the connectors aged at 150 ℃ for times till 720 h. The results showed that during aging the connectors, an intermetallic (IMC) layer of Cu6Sn5 and Cu3Sn was formed at the interface between the Cu terminal and the Sn-Pb alloy solder. Meanwhile, a Pb-rich layer in the Sn-Pb solder adjacent to the IMC layer was also formed. The IMC layer followed a parabolic growth kinetics with a growth rate constant, k=3.5×10-17 m2/s. Compared with the connectors without aging, the shear strength of the connectors aged at 150 ℃ for 720 h decreased about 20%. The fracture of the connectors also changed from the toughness fracture through the Sn-Pb solder to the brittle fracture through the Pb-rich layer. Moreover, the electrical resistivity of the connectors also increased obviously after aging.
中图分类号 TG454
所属栏目 试验与研究
基金项目 国家电网科技项目(103-413445)
收稿日期 2013/6/15
修改稿日期
网络出版日期
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备注汤晓磊(1983-), 男, 硕士研究生。
引用该论文: TANG Xiao-lei,CHEN Guo-hong,LIU Jun-jian,WANG Jia-qing,YUAN Feng,HE Tian-lei,ZHANG Tao,TANG Wen-ming. Influence of Artificial Aging on Microstructures and Properties of Plane Contact Type Cu/Al Terminal Connectors[J]. Physical Testing and Chemical Analysis part A:Physical Testing, 2014, 50(3): 169～174
汤晓磊,陈国宏,刘俊建,王家庆,袁锋,何天磊,张涛,汤文明. 时效对平面接触型铜/铝设备线夹组织结构及性能的影响[J]. 理化检验－物理分册, 2014, 50(3): 169～174
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【3】胡东元.钎焊平面接触型Cu/Al设备线夹应用分析[J].农村电工, 2011(11):28-29.
【4】TAKENAKA T, KANO S, KAJIHARA M. Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433-473 K[J].Materials Science and Engineering, 2005, A396:115-123.
【5】CHANG T C, WANG M C, HON M H. Growth and morphology of the intermetallic compounds formed at the Sn-9Zn-2.5Ag/Cu interface[J].Journal of Alloys and Compounds, 2005, 402:141-148.
【6】YOON J W, LEE Y H, KIM D G, et al. Intermetallic compound layer growth at the interface between Sn-Cu-Ni solder and Cu substrate[J].Journal of Alloys and Compounds, 2004, 381:151-157.
【7】KIM K S, YU C H, YANG J M. Aging treatment characteristics of solder bump joint for high reliability optical module[J].Thin Solid Films, 2004, 462/463:402-407.
【8】陈国宏, 闵良, 王家庆.20 kV变电站Cu/Al过渡线夹腐蚀与断裂分析[J].安徽电力, 2010, 27(4):1-5.
【9】李瑞, 杨卫民, 余虹云, 等.浙江某500 kV变电站线夹开裂原因分析[J].电力建设, 2005, 26(8):30-40.
【10】杨南培.Cu/Al设备线夹超声波浸锡与钎焊工艺[J].焊接技术, 2011, 40(11):32-34.
【11】LEE W B, BANG K S, JUNG S B. Effects of intermetallic compound on the electrical and mechanical properties of friction welded bimetallic joints during annealing[J].Journal of Alloys and Compounds, 2005, 390(1/2):212-219.
【12】OUYANG J, YARRAPAREDDY E, KOVACEVIC R. Microstructural evolution in the friction stir welded 6061 aluminum alloy (T6-temper condition) to copper[J].Journal of Materials Processing Technology, 2006, 172(1):110-112.
【13】WU Y, SEES J A, POURAGHABAGHER C, et al. The formation and growth of intermetallics in composite solder[J].J Electron Mater, 1993, 22:769-777.
【14】FUJIWARA Y. Sn deposition onto Cu and alloy layer growth by a contact immersion process[J].Thin Solid Films, 2003, 425(1/2):121-126.
【15】KIM Y M, ROH H R, KIM S. Kinetics of intermetallic compound formation at the interface between Sn-3.0Ag-0.5Cu solder and Cu-Zn alloy substrates[J].J Electron Mater, 2010, 39(12):2504-2512.
【16】YU C Y, WANG K J, DUH J G. Interfacial reaction of Sn and Cu-xZn substrates after reflow and thermal aging[J].J Electron Mater, 2010, 39(2):230-237.
【17】CHAN Y C, SO A C K, LAI J K L. Growth kinetic studies of Cu-Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints[J].Mater Sci Eng, 1998, 55B:5-13.
【18】FREAR D R, VIANCO P T. Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys[J].Metall Mater Trans, 1994, 25A:1509-1523.
【19】TANG Wen-ming, HE An-qiang, LIU Qi, et al. Solid state interfacial reactions in electrodeposited Cu/Sn couples[J].Trans Nonferrous Metal Soc China, 2010, 20: 90-96.
【20】TANG Wen-ming, HE An-qiang, LIU Qi, et al. Room temperature interfacial reactions in electrodeposited Au/Sn couples[J].Acta Mater, 2008, 56:5618-5827.
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