Kinetics of Attachment of Sulphate-Reducing Bacteria
摘 要
利用电化学交流阻抗谱(EIS)分析和研究了硫酸盐还原菌(SRB)在银、金、玻碳、Q235碳钢和高钼双相不锈钢电极表面的粘附动力学过程。基于EIS检测数据并通过公式推导提出了评估硫酸盐还原菌(SRB)附着过程的双电层电容变化模型。另外石英晶体微天平(QCM)和扫描电子显微镜(SEM)也被用来表征细菌粘附的动力学过程。
Abstract
The kinetics of attachment of sulphate-reducing bacteria (SRB) on silver, gold, glassy-carbon, Q235 carbon steel and high molybdenum stainless steel was analyzed and studied using electrochemical impedance spectroscopy (EIS). Based on the data from EIS and the formula derivation, a model was proposed to evaluate the variation of double electric layer during the attachment process of SRB. The kinetic process of bacterial attachment was also characterized by quartz crystal microbalance (QCM) and scanning electron microscopy (SEM).
中图分类号 TG172.7
所属栏目 试验研究
基金项目 国家自然科学基金项目(No.40876041); 国家支撑计划项目(No.2007BAB27B01); 中国科学院创新工程重要方向项目(No.KZCZYW210)资助
收稿日期 2010/5/23
修改稿日期 2010/6/27
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备注张盾,研究员,
引用该论文: LIU Huai-qun,WAN Yi,ZHANG Dun,HOU Bao-rong. Kinetics of Attachment of Sulphate-Reducing Bacteria[J]. Corrosion & Protection, 2011, 32(2): 81
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参考文献
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【10】Morisaki H,Sugimoto M,Shiraishi H. Attachment of bacterial cells to carbon electrodes[J]. Bioelectrochemistry,2000,51(1):21-25.
【11】Geng P,Zhang X,Meng W,et al. Self-assembled monolayers-based immunosensor for detection of Escherichia coli using electrochemical impedance spectroscopy[J]. Electrochim Acta,2008,53(14):4663-4668.
【12】Ruan C,Yang L,Li Y. Immunobiosensor chips for detection of Escherichia coli O157:H7 using electrochemical impedance spectroscopy[J]. Anal Chem,2002,74(18):4814-4820.
【13】Munoz-Berbel X,Vigués N,Jenkins A T A,et al. Impedimetric approach for quantifying low bacteria concentrations based on the changes produced in the electrode-solution interface during the pre-attachment stage[J]. Biosens Bioelectron,2008,23(10):1540-1546.
【14】Munoz-Berbel X,Vigués N,Mas J,et al. Impedimetric characterization of the changes produced in the electrode-solution interface by bacterial attachment[J]. Electrochem Commun,2007,9(11):2654-2660.
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