EDTA体系无氰碱性镀铜的电化学成核机理
Electrochemical Nucleation of Cyanide-free Alkaline Copper Plating from EDTA Bath
摘 要
采用循环伏安法和计时电流暂态曲线研究了EDTA(乙二胺四乙酸)体系无氰碱性镀铜的电化学成核机理。结果表明, 铜在玻碳电极上的沉积遵循3D“成核/生长”机制; 计时电流暂态曲线分析表明, 在高负电位下铜离子的结晶成核方式遵循瞬时成核机制, 低负电位下则趋向遵循连续成核机制, 且过电位增加会促进铜离子结晶形核, 随最大电流Im增大, 电结晶成核数增多。
EDTA(乙二胺四乙酸)
计时电流法
电化学成核
alkaline copper plating
EDTA (ethylene diamine tetraacetic acid)
chronoamperometry
electrochemical nucleation
Abstract
Electrochemical nucleation of cyanide-free alkaline copper plating from EDTA (ethylene diamine tetraacetic acid) bath was studied by means of cyclic voltammetry and chronoamperometry techniques.The deposition of copper follows three dimensional nucleation/growth mechanism. The analyzing of potentionstatic transients indicates that in the case of high negative potentials, the nucleation process of metal ions follows the instantaneous nucleation mechanism, in the case of low negative potentials, it is close to the progressive nucleation mechanism, and with the increase in overpotential the copper ion crystal nucleation is promoted, the maximum current Im gradually increases and the number of crystal nucleation increases.
中图分类号 TQ153.14
所属栏目 试验研究
基金项目
收稿日期 2012/10/8
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备注赵晴, 教授, 学士,
引用该论文: ZHAO Qing,ZHAO Lin,DU Nan,ZHANG Chuan-bo,WANG Li-qiang,JIAN Zhi-chao. Electrochemical Nucleation of Cyanide-free Alkaline Copper Plating from EDTA Bath[J]. Corrosion & Protection, 2013, 34(3): 220
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参考文献
【1】Bozzini B D, Urzo L, Mele C, et al. Electrodeposition of Cu from acidic sulphate solutions in the presence of polyethylene glycol and chloride ions [J].Journal of Materials Science:Materials in Electronics, 2006, 17(11):915-923.
【2】辜敏, 李强, 鲜晓红, 等.PEG-Cl-添加剂存在下的铜电结晶过程研究[J].化学学报, 2007, 65(10): 881-886.
【3】Mockute D, Bemotiene G. The interaction of additives with the cathode in a mixture of saccharin, 2-butyne-1, 4-diol and phthalimide during nickel electrodeposition in a Watts-type electrolyte[J].Surf Coat Technol, 2000, 135(1):42-47.
【4】Varvara S, Muresan L, Popescu I C, et al. Copper electrodeposition from sulfate electrolytes in the presence of hydroxyethylated 2-butyne-1, 4-diol [J].Hydrometallurgy, 2004, 75(14):147-156.
【5】Schrifker, Hills G. Theoretical and experimental studies of multiple nucleation[J].Electrochim Acta, 1983, 28(7): 879-889.
【6】赵旭山, 谭澄宇, 陈文敬, 等.Ni-SiC 复合镀层电结晶初期动力学分析[J].中国有色金属学报, 2008, 18(5): 823-828.
【7】Gomez E, Muller C, Proud W G, et al. Electrodeposition of nickel on vitreous carbon: influence of potential on deposit morphology[J].Journal of Applied Electrochemistry, 1999, 22(9):872-876.
【2】辜敏, 李强, 鲜晓红, 等.PEG-Cl-添加剂存在下的铜电结晶过程研究[J].化学学报, 2007, 65(10): 881-886.
【3】Mockute D, Bemotiene G. The interaction of additives with the cathode in a mixture of saccharin, 2-butyne-1, 4-diol and phthalimide during nickel electrodeposition in a Watts-type electrolyte[J].Surf Coat Technol, 2000, 135(1):42-47.
【4】Varvara S, Muresan L, Popescu I C, et al. Copper electrodeposition from sulfate electrolytes in the presence of hydroxyethylated 2-butyne-1, 4-diol [J].Hydrometallurgy, 2004, 75(14):147-156.
【5】Schrifker, Hills G. Theoretical and experimental studies of multiple nucleation[J].Electrochim Acta, 1983, 28(7): 879-889.
【6】赵旭山, 谭澄宇, 陈文敬, 等.Ni-SiC 复合镀层电结晶初期动力学分析[J].中国有色金属学报, 2008, 18(5): 823-828.
【7】Gomez E, Muller C, Proud W G, et al. Electrodeposition of nickel on vitreous carbon: influence of potential on deposit morphology[J].Journal of Applied Electrochemistry, 1999, 22(9):872-876.
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