晶粒度对铜点蚀行为的影响
Effect of Grain Size on Pitting Corrosion Behavior of Copper
摘 要
采用循环极化测试和电化学阻抗谱测试,考察分析了不同晶粒度在不同溶液中对铜点蚀行为的影响。利用光学显微镜、扫描电镜和电化学工作站对不同晶粒度的铜试样在三种溶液中的腐蚀形貌和电化学性能进行表征和测量。结果表明,在含SO42-/HCO3-的溶液体系中铜发生活性溶解型点蚀,且点蚀敏感性随晶粒度减小而增加;在含OH-的碱性环境中,晶粒度减小将促进铜快速形成具有保护性的钝化膜层;SO42-将导致铜在OH-碱性环境中发生钝化膜破裂型点蚀,其点蚀敏感性随晶粒度减小而降低。
铜
点蚀
电化学阻抗谱
grain size
copper
pitting corrosion
electrochemical impedance spectroscopy
Abstract
Circular polarization and electrochemical impedance spectroscopy(EIS)were used to analyze the effect ofdifferent grain sizes on the pitting corrosion behavior of fine copper.Optical microscopy,scanning electronmicroscopy(SEM)and electrochemical workstation were used to analyze the surface properties of copper specimenswith different grainsizes in three kinds of solution.The results indicate that active dissolved pitting corrosion of Cuoccurred in SO42-/HCO3-mixed solution,the pitting sensitivity of Cu increased with the reduction of grain size;but in the alkaline solution with OH-,the reduction of grain size promoted the formation of the protective passivefilm which owns fine self-healing capacity.SO42-led to the film rupture of Cu in the alkaline solution with OH-.The smaller the grain size,the weaker the pitting sensitivity of Cu surface.
中图分类号 TG172.6+3
所属栏目 试验研究
基金项目 国家自然科学基金(50571059,50615024);汽车用钢开发与应用技术国家重点试验室(宝钢)开放课题;教育部新世纪优秀人才支持计划资助项目(NCET-07-0536)
收稿日期 2013/2/28
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备注钟庆东,教授,博士,
引用该论文: LI Ke,ZHANG Ping,LIU Hui-juan,ZHOU Qiong-yu,ZHONG Qing-dong. Effect of Grain Size on Pitting Corrosion Behavior of Copper[J]. Corrosion & Protection, 2013, 34(11): 972
被引情况:
【1】张建丽,朱力华,王大鹏,高立新,张大全, "HAl77-2铜合金管在低温多效海水淡化装置中的耐蚀性",腐蚀与防护 37, 484-489(2016)
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参考文献
【1】刘平,田保红,赵冬梅.铜合金功能材料[M].北京:科学出版社,2004.
【2】雷惊雷,李凌杰,蔡生民,等.弱碱性介质中氯离子对铜电极腐蚀行为的影响 [J].物理化学学报,2001,17(12):1107-1111.
【3】Yin S B,Li D Y.Effects of prior cold work on corro-sion and corrosive wear of copper in HNO3and NaClsolutions[J].Materials Science and Engineering,2005,394(1/2):266-276.
【4】Li W,Li D Y.Variations of work function and corro-sion behaviors of deformed copper surfaces[J].Ap-plied Surface Science,2005,240(1/4):388-395.
【5】Guo W Y,Sun J,Wu J S.Effect of deformation oncorrosion behavior of Ti-23Nb-0.7Ta-2Zr-O alloy[J].Materials Characterization,2009,60(3):173-177.
【6】Zhang X,Boelen B,Beentyes P,et al.Influence of u-niaxial deformation on the corrosion behavior of pre-coated packaging steel[J].Progress in Organic Coat-ings,2007,60(4):335-342.
【7】Harandi S E,Idris M H,Jafari H.Effect of forgingprocess on microstructure,mechanical and corrosionproperties of biodegradable Mg-Ca alloy[J].Materialsand Design,2011,32(5):2596-2603.
【8】Gao K W,Liu M Y,Zou F L,et al.Characterizationof microstructure evolution after severe plastic deform-ation of pure copper with continuous columnar crystals[J].Materials Science and Engineering,2010,527(18/19):4750-4757.
【9】Chen J,Yan W,Li W,et al.Texture evolution andits simulation of cold drawing copper wires producedby continuous casting,Trans[J].Transactions ofNonferrous Metals Society of China,2011,21(1):152-158.
【10】Yu B,Woo P,Erb U.Corrosion behaviour of nano-crystalline copper foil in sodium hydroxide solution[J].Scripta Materialia,2007,56(5):353-356.
【11】Luo W,Xu Y M,Wang Q M,et al.Effect of grainsize on corrosion of nanocrystalline copper in NaOHsolution[J].Corrosion Science,2010,52(10):3509-3513.
【12】Shi P Z,Wang Q M,Xu Y M,et al.Corrosion be-havior of bulk nanocrystalline copper in ammonia so-lution[J].Materials Letters,2011,65(5):857-859.
【13】Robin A,Aristides G,Martinez S,et al.Effect ofcold-working process on corrosion behavior of copper[J].Materials and Design,2012,34:319-324.
【14】徐群杰,朱律均,齐航,等.Cu的腐蚀与缓蚀的光电化学研究[J].金属学报,2008,44(11):1360-1365.
【15】丁杰,林海潮,曹楚南.HSn70-1B铜管在碱性NaCl溶液中的腐蚀行为[J].腐蚀科学与防护技术,2002,14(2):67-72.
【16】王长罡,董俊华,柯伟,等.HCO3-和SO42-对Cu点蚀行为的影响[J].金属学报,2012,48(1):85-93.
【17】Wang L P,Zhang J Y,Gao Y,et al.Grain sizeeffect in corrosion behavior of electrodeposited nano-crystalline Ni coatings in alkaline solution[J].ScriptaMaterialia,2006,55(7):657-660.
【18】Lu G J,Zangari G.Corrosion resistance of ternaryNi-P based alloys in sulfuric acid solutions[J].Elec-trochimica Acta,2002,47(18):2969-2979.
【19】Cruz R P V,Nishikata A,Tsuru T.AC impedancemonitoring of pitting corrosion of stainless steel undera wet-dry cyclic condition in chloride-containing envi-ronment[J].Corrosion Science,1996,38(8):1397-1406.
【20】Wu H Y,Wang Yi,Zhong Q D,et al.The semi-conductor property and corrosion resistance of passivefilm on electroplated Ni and Cu-Ni alloys[J].Journalof Electroanalytical Chemistry,2011,663(2): 59-66.
【2】雷惊雷,李凌杰,蔡生民,等.弱碱性介质中氯离子对铜电极腐蚀行为的影响 [J].物理化学学报,2001,17(12):1107-1111.
【3】Yin S B,Li D Y.Effects of prior cold work on corro-sion and corrosive wear of copper in HNO3and NaClsolutions[J].Materials Science and Engineering,2005,394(1/2):266-276.
【4】Li W,Li D Y.Variations of work function and corro-sion behaviors of deformed copper surfaces[J].Ap-plied Surface Science,2005,240(1/4):388-395.
【5】Guo W Y,Sun J,Wu J S.Effect of deformation oncorrosion behavior of Ti-23Nb-0.7Ta-2Zr-O alloy[J].Materials Characterization,2009,60(3):173-177.
【6】Zhang X,Boelen B,Beentyes P,et al.Influence of u-niaxial deformation on the corrosion behavior of pre-coated packaging steel[J].Progress in Organic Coat-ings,2007,60(4):335-342.
【7】Harandi S E,Idris M H,Jafari H.Effect of forgingprocess on microstructure,mechanical and corrosionproperties of biodegradable Mg-Ca alloy[J].Materialsand Design,2011,32(5):2596-2603.
【8】Gao K W,Liu M Y,Zou F L,et al.Characterizationof microstructure evolution after severe plastic deform-ation of pure copper with continuous columnar crystals[J].Materials Science and Engineering,2010,527(18/19):4750-4757.
【9】Chen J,Yan W,Li W,et al.Texture evolution andits simulation of cold drawing copper wires producedby continuous casting,Trans[J].Transactions ofNonferrous Metals Society of China,2011,21(1):152-158.
【10】Yu B,Woo P,Erb U.Corrosion behaviour of nano-crystalline copper foil in sodium hydroxide solution[J].Scripta Materialia,2007,56(5):353-356.
【11】Luo W,Xu Y M,Wang Q M,et al.Effect of grainsize on corrosion of nanocrystalline copper in NaOHsolution[J].Corrosion Science,2010,52(10):3509-3513.
【12】Shi P Z,Wang Q M,Xu Y M,et al.Corrosion be-havior of bulk nanocrystalline copper in ammonia so-lution[J].Materials Letters,2011,65(5):857-859.
【13】Robin A,Aristides G,Martinez S,et al.Effect ofcold-working process on corrosion behavior of copper[J].Materials and Design,2012,34:319-324.
【14】徐群杰,朱律均,齐航,等.Cu的腐蚀与缓蚀的光电化学研究[J].金属学报,2008,44(11):1360-1365.
【15】丁杰,林海潮,曹楚南.HSn70-1B铜管在碱性NaCl溶液中的腐蚀行为[J].腐蚀科学与防护技术,2002,14(2):67-72.
【16】王长罡,董俊华,柯伟,等.HCO3-和SO42-对Cu点蚀行为的影响[J].金属学报,2012,48(1):85-93.
【17】Wang L P,Zhang J Y,Gao Y,et al.Grain sizeeffect in corrosion behavior of electrodeposited nano-crystalline Ni coatings in alkaline solution[J].ScriptaMaterialia,2006,55(7):657-660.
【18】Lu G J,Zangari G.Corrosion resistance of ternaryNi-P based alloys in sulfuric acid solutions[J].Elec-trochimica Acta,2002,47(18):2969-2979.
【19】Cruz R P V,Nishikata A,Tsuru T.AC impedancemonitoring of pitting corrosion of stainless steel undera wet-dry cyclic condition in chloride-containing envi-ronment[J].Corrosion Science,1996,38(8):1397-1406.
【20】Wu H Y,Wang Yi,Zhong Q D,et al.The semi-conductor property and corrosion resistance of passivefilm on electroplated Ni and Cu-Ni alloys[J].Journalof Electroanalytical Chemistry,2011,663(2): 59-66.
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