High Temperature Creep Behavior of Cu-0.2Zr Alloy and Cu-3Ag-0.5Zr Alloy
摘 要
研究了Cu-0.2Zr(质量分数/%, 下同)合金和Cu-3Ag-0.5Zr合金在700, 800, 900 K下的拉伸蠕变行为, 并分析了两种合金的蠕变机理。结果表明: 铜-锆合金的抗蠕变性能优于铜-银-锆合金的; 在700 K的蠕变区, 位错粘滞滑移是两种合金蠕变过程的控制机制, 在800 K的蠕变区, 两种合金的蠕变过程主要由晶界扩散机制所控制; 高温蠕变断裂时两种合金均表现为韧性沿晶断裂, 并存在二次裂纹, 铜-锆合金断口的孔洞较多, 两种合金的蠕变断裂数据符合Monkman-Grant关系。
Abstract
High temperature (700, 800, 900 K)tensile creep behavior and creep mechanism of Cu-0.2Zr alloy and Cu-3Ag-0.5Zr alloy were studied. The results indicate that the creep resistance of Cu-Zr alloy was better than that of Cu-Ag-Zr alloy. At temperature of 700 K, viscous dislocation slip was the creep process control mechanism of two alloys. At temperature of 800 K, the creep process of two alloys was mainly controlled by grain boundary diffusion mechanism. High temperature creep fracture of two alloys showed ductile intergranular fracture with secondary cracks, there were many cacities on the fracture of the Cu-Zr alloy. Creep rupture data of two alloys corresponded with the Monkman-Grant relationship.
中图分类号 TG146.11
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收稿日期 2010/12/30
修改稿日期 2011/9/7
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备注张超(1986-), 男, 江苏张家港人, 助理实验师,硕士。
引用该论文: ZHANG Chao,DING Zhao-bo,XU Yu-song. High Temperature Creep Behavior of Cu-0.2Zr Alloy and Cu-3Ag-0.5Zr Alloy[J]. Materials for mechancial engineering, 2011, 35(12): 38~43
张超,丁兆波,徐玉松. Cu-0.2Zr合金和Cu-3Ag-0.5Zr合金的高温蠕变行为[J]. 机械工程材料, 2011, 35(12): 38~43
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参考文献
【1】方正春.耐热和导电铜合金发展现状[J]. 材料开发与应用,1997,12(4):27-30.
【2】MORRIS D G. Influence of solidification conditions, thermomechanical processing, and alloying additions on the structure and properties of in situ composite Cu-Ag alloys [J]. Scripta Materialia,1999,41(10):1123-1124.
【3】KATAGIRI K. Stress/strain dependence of critical current in Cu-Ag externally reinforced Ag-Zr/Bi-2212 superconducting tapes [J]. Cryogenics,1999,39(5):453-458.
【4】冯端.金属物理[M]. 北京:科学出版社,1999.
【5】哈宽富.金属力学性质的微观理论[M]. 北京:科学出版社,1993.
【6】MUKHERJEE A K, BIRD J E, DORN J E.Experimental correlations for high-temperature creep[J]. Trans ASM,1969, 62: 62-68
【7】COBLE R L.A model for boundary diffusion controlled creep in polycrystalline materials[J]. J Appl Phys, 1963,34(6):1679-1682.
【8】MOHAMED F A. The transition from dislocation climb to viscous glide in creep of solid solution alloys[J]. Acta Metall,1974,22(6):779-788.
【9】WEERTMAN J.Stready-state creep through dislocation climb[J]. J Appl Phys,1957,28(3):362-364.
【10】束德林.金属力学性能[M]. 北京:机械工业出版社,1987.
【11】陈建桥.材料强度学[M]. 武汉:华中科技大学出版社,2008.
【12】MONKAN F C, GRANT N J.An empirical relationship between rupture life and minimum creep rate in creep rupture tests[J]. Proc ASTM,1956,56(22):593-620.
【2】MORRIS D G. Influence of solidification conditions, thermomechanical processing, and alloying additions on the structure and properties of in situ composite Cu-Ag alloys [J]. Scripta Materialia,1999,41(10):1123-1124.
【3】KATAGIRI K. Stress/strain dependence of critical current in Cu-Ag externally reinforced Ag-Zr/Bi-2212 superconducting tapes [J]. Cryogenics,1999,39(5):453-458.
【4】冯端.金属物理[M]. 北京:科学出版社,1999.
【5】哈宽富.金属力学性质的微观理论[M]. 北京:科学出版社,1993.
【6】MUKHERJEE A K, BIRD J E, DORN J E.Experimental correlations for high-temperature creep[J]. Trans ASM,1969, 62: 62-68
【7】COBLE R L.A model for boundary diffusion controlled creep in polycrystalline materials[J]. J Appl Phys, 1963,34(6):1679-1682.
【8】MOHAMED F A. The transition from dislocation climb to viscous glide in creep of solid solution alloys[J]. Acta Metall,1974,22(6):779-788.
【9】WEERTMAN J.Stready-state creep through dislocation climb[J]. J Appl Phys,1957,28(3):362-364.
【10】束德林.金属力学性能[M]. 北京:机械工业出版社,1987.
【11】陈建桥.材料强度学[M]. 武汉:华中科技大学出版社,2008.
【12】MONKAN F C, GRANT N J.An empirical relationship between rupture life and minimum creep rate in creep rupture tests[J]. Proc ASTM,1956,56(22):593-620.
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