HEDP-ATMP-TTA缓蚀剂对HSn70-1A铜合金强激光与粒子束腐蚀行为的影响
Effect of Inhibitior HEDP-ATMP-TTA on Corrosion of HSn70-1A Copper-alloy
摘 要
通过静态失重法、极化曲线法、电化学阻抗谱测定了HEDP-ATMP-TTA复配缓蚀剂在循环冷却水介质中硫酸盐还原菌(SRB)作用下对HSn70-1A铜合金的协同缓蚀作用,讨论了缓蚀剂浓度和SRB对铜合金腐蚀行为的影响.结果表明:当循环冷却水介质中加入该缓蚀剂后,可以改善SRB对HSn70-1A铜合金的侵蚀程度:随着缓蚀剂浓度的增加,合金腐蚀速率逐渐下降,缓蚀率逐渐提高.
硫酸盐还原菌
缓蚀剂
极化曲线
电化学阻抗谱
HSn70-1A copper-alloy
sulfate-reducing bacteria
corrosion inhibitor
polarization curve
electrochemical impedance spectroscopy
Abstract
Synergistic effect of HEDP,ATMP and TTA on corrosion inhibition of HSn70-1A copper-alloy in the industrial recirculation cooling water inoculated with SRB was studied by means of weight loss method、electrochemical polarization and electrochemical impedance spectroscopy(EIS) techniques.It was found that there was a synergistic effect between HEDP,ATMP and TTA.The corrosion rate of HSn70-1A copper-alloy descended with enhancement of concentration of the corrosion inhibitor.
中图分类号 TG174.42
所属栏目 应用技术
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收稿日期 2008/3/19
修改稿日期 2008/6/18
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引用该论文: ZHENG Qiang,YAN Li. Effect of Inhibitior HEDP-ATMP-TTA on Corrosion of HSn70-1A Copper-alloy[J]. Corrosion & Protection, 2009, 30(4): 276～278
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参考文献
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