SnAgCu和SnPb焊锡在含活性剂介质中的电化学腐蚀性能
Electrochemical Corrosion Behavior of SnAgCu and SnPb Solder Alloys in Solution with Activator
摘 要
用动电位极化法研究了无铅焊锡合金Sn-3.0Ag-0.5Cu和锡铅焊锡合金Sn-37Pb在20 ℃、0.1 mol/L乙二酸水溶液中的电化学腐蚀性能,并与其在相同温度下的0.1 mol/L NaCl水溶液中的性能进行了比较,利用扫描电子显微镜(SEM)、X射线能谱仪(EDS)和X射线衍射仪(XRD)分析了腐蚀产物的形貌和成分.结果表明:在两种腐蚀溶液中,Sn-3.0Ag-0.5Cu的耐蚀性能均优于Sn-37Pb.在0.1 mol/L乙二酸水溶液中,两种焊锡都产生了电化学钝化,表面腐蚀产物均为草酸亚锡,其钝化机理符合成相膜理论.而在0.1 mol/L NaCl水溶液中,两种焊锡均无钝化现象.
锡铅焊锡
电化学腐蚀
动电位极化
乙二酸
SnAgCu solder
SnPb solder
electrochemical corrosion
potentiodynamic polarization
oxalic acid
Abstract
The electrochemical corrosion behavior of lead-free Sn-3.0Ag-0.5Cu and Sn-37Pb solder alloys in 0.1 mol/L oxalic acid solution at 20 ℃ was investigated by potentiodynamic polarization method and compared with the results in 0.1 mol/L NaCl solution.The corrosion products were observed by SEM and the chemical components were examined by EDS and XRD.The results showed that Sn-37Pb solder had poor corrosion resistance compared with Sn-3.0Ag-0.5Cu in both two media.In oxalic acid solution two solders ethibited passivation,and the corrosion products were stannous oxalate mainly,the passivation mechanism of the solders accorded with the film forming theory.But there was no passivation phenomenon in 0.1 mol/L NaCl solution.
中图分类号 TG146 TG174.3
所属栏目 试验研究
基金项目 陕西省自然科学研究计划资助项目(2002E111)
收稿日期 2009/6/3
修改稿日期 2009/7/31
网络出版日期
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联系人作者薛静(waxpz815@163.com)
备注薛静,硕士研究生.
引用该论文: XUE Jing,ZHAO Mai-qun,LI Tao,GAO Peng. Electrochemical Corrosion Behavior of SnAgCu and SnPb Solder Alloys in Solution with Activator[J]. Corrosion & Protection, 2010, 31(4): 283～286
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【5】Masato Mori,Kazuma Miura,Takeshi Sasaki,et al.Corrosion of tin alloys in sulfuric and nitric acids[J].Corros Sci,2002,44(4):887-898.
【6】Rosalbino F,Angelini E,Zanicchi G,et al.Corrosion behaviour assessment of lead-free Sn-Ag-M(M=In,Bi,Cu) solder alloys[J].Mater Chem Phys,2008,109(2/3):386-391.
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【13】黄建中,左禹.材料的耐蚀性和腐蚀数据[M].北京:化学工业出版社,2003:317.
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