AlNp/Cu复合材料的热学性能
Thermal Properties of AlNp/Cu Composites
摘 要
采用粉末冶金工艺制备了不同体积分数的AlNp/Cu系列复合材料,研究了复合材料从50~550 ℃的热膨胀行为,对不同体积分数的AlNp/Cu 复合材料发生热变形的温度范围进行了分析计算,测定了AlNp/Cu复合材料塑性变形后的软化温度.结果表明：AlN的加入能够提高铜基体的软化温度且对铜基体的热膨胀起到明显的约束作用;在孔隙与热应力共同作用下,AlN颗粒含量达到一定程度时,AlNp/Cu复合材料膨胀曲线随温度的上升将产生非线性变化;加热过程中热应力造成的基体塑性变形使热循环后复合材料存在残余正应变.
铜基复合材料
热膨胀行为
软化温度
AlN
copper-matrix composite
thermal expansion behavior
soft temperature
Abstract
Pure copper and its composites reinforced with different volume fractions of AlN particles were prepared by powder metallurgy.The thermal expansion behavior of composites was studied from 50 ℃ to 550 ℃.The temperature range of matrix plastic deforming caused by thermal stresses was calculated with mises yield rule.The soft temperature of AlNp/Cu after plastic deforming was measured.The soft temperature of copper matrix could be effectively improved and thermal expansion of copper matrix could be effectively restrained by the AlN particles;Under the action of porosity and thermal stresses,the thermal expansion curve of AlNp/Cu composites became non-linear with the particle volume contents increasing to a certain extent.The composites exhibited positive residual strain when cooled down from the peak temperature to room temperature because of the copper matrix plastic deformation caused by thermal stresses.
中图分类号 TG135.6
所属栏目
基金项目 国家自然科学基金资助项目(50271024)
收稿日期 2005/4/4
修改稿日期 2005/6/24
网络出版日期
作者单位点击查看
备注刘德宝(1971-),男,天津人,博士研究生.
引用该论文: LIU De-bao,CUI Chun-xiang. Thermal Properties of AlNp/Cu Composites[J]. Materials for mechancial engineering, 2006, 30(6): 58～62
刘德宝,崔春翔. AlNp/Cu复合材料的热学性能[J]. 机械工程材料, 2006, 30(6): 58～62
被引情况:
【1】路王珂,谢敬佩,王爱琴,李继文,张银娣, "退火温度对铜铝铸轧复合板界面组织和力学性能的影响",机械工程材料 38, 14-17(2014)
共有人对该论文发表了看法，其中：
人认为该论文很差
人认为该论文较差
人认为该论文一般
人认为该论文较好
人认为该论文很好
参考文献
【1】聂存珠,赵乃勤.金属基电子封装复合材料的研究进展[J].金属热处理,2003,28(6):1-4.
【2】张蜀平,郑红宇.电子封装技术的新进展[J].电子与封装,2004,4(1):4-9.
【3】周和平,刘耀成,吴音.氮化铝陶瓷的研究与应用[J].硅酸盐学报,1998,26(4):517-522.
【4】秦明礼,曲选辉,林健凉,等.氮化铝陶瓷研究和进展[J].稀有金属材料与工程,2002,31(1):8-12.
【5】Rajendra U Vaidua,Chairla K K.Thermal expansion of metal matrix composites[J].Composites Science and Technology,1994,50(1):13-32.
【6】俞汉清,陈金德.金属塑性成性原理[M].北京:机械工业出版社,2002.
【7】Tan M J,Zhang X.Powder metal matrix composites:selection and processing[J].Materials Science and Engineering,1998,A244:80-85.
【8】Shu Kuen-Ming,Tu G C.The microsturcture and the thermal expansion characteristics of Cu/SiCP composites[J].Materials Science and Engineering,2003,A349:236-247.
【9】陈民芳.电阻焊电极用新型复合材料的试制及应用研究[D].天津:天津大学,1997.
【10】赵品,谢辅洲,孙文山,等.材料科学基础[M].哈尔滨:哈尔滨工业大学出版社,2000.
【11】Katsuhito,Yoshida,Hideaki,et al.Thermal properties of diamond/copper composites material[J].Microelectronics Reliability,2004,44:303-308.
【12】陈民芳,赵乃勤,由臣,等.WC/Cu复合材料粉末冶金烧结工艺研究[J].机械工程材料,1998,22(3):28-30.
【2】张蜀平,郑红宇.电子封装技术的新进展[J].电子与封装,2004,4(1):4-9.
【3】周和平,刘耀成,吴音.氮化铝陶瓷的研究与应用[J].硅酸盐学报,1998,26(4):517-522.
【4】秦明礼,曲选辉,林健凉,等.氮化铝陶瓷研究和进展[J].稀有金属材料与工程,2002,31(1):8-12.
【5】Rajendra U Vaidua,Chairla K K.Thermal expansion of metal matrix composites[J].Composites Science and Technology,1994,50(1):13-32.
【6】俞汉清,陈金德.金属塑性成性原理[M].北京:机械工业出版社,2002.
【7】Tan M J,Zhang X.Powder metal matrix composites:selection and processing[J].Materials Science and Engineering,1998,A244:80-85.
【8】Shu Kuen-Ming,Tu G C.The microsturcture and the thermal expansion characteristics of Cu/SiCP composites[J].Materials Science and Engineering,2003,A349:236-247.
【9】陈民芳.电阻焊电极用新型复合材料的试制及应用研究[D].天津:天津大学,1997.
【10】赵品,谢辅洲,孙文山,等.材料科学基础[M].哈尔滨:哈尔滨工业大学出版社,2000.
【11】Katsuhito,Yoshida,Hideaki,et al.Thermal properties of diamond/copper composites material[J].Microelectronics Reliability,2004,44:303-308.
【12】陈民芳,赵乃勤,由臣,等.WC/Cu复合材料粉末冶金烧结工艺研究[J].机械工程材料,1998,22(3):28-30.
相关信息
