CuW80/Cu整体式触头尾部铜强化规律
Copper Strengthening of CuW80/Cu Integrated Contact Material
摘 要
研究了粉末冶金熔渗烧结法制备的CuW80/Cu整体式触头材料尾部铜经挤压变形后硬度的变化规律,并用三维视频显微镜和透射电镜进行显微组织结构分析.结果表明:尾部铜经挤压变形后,硬度显著提高,增幅约200%,挤压工艺是CuW80/Cu整体式触头材料尾部铜强化处理的有效手段.尾部铜沿横截面从芯部到表面,越接近表面,其硬度值越大;沿纵截面,从CuW80/Cu界面到末端,硬度提高.即使挤压变形很小,尾部铜仍产生了位错缠结,挤压严重部分产生大量位错胞组织.
CuW80/Cu
挤压强化
显微硬度
位错
integrated contact material
CuW80/Cu
extrusion strengthening
microhardness
dislocation
Abstract
The extrusion strengthening of the copper being in the tail of CuW80/Cu integrated contact material,which was prepared by powder metallurgy sintering,was investigated.Microhardness of the copper after extrusion was measured along longitudinal and horizontal sections,and correspondingly,microstructure was observed by three-dimension video microscopy and transmission electron microscopy (TEM).The hardness of the copper increased remarkably after extrusion,which was 200% higher than that before extrusion,indicating that extrusion was one of the efficient ways to strengthen the copper in the tail of CuW80/Cu integrated contact material.In horizontal sections,the hardness of copper after the extrusion increased from inner to surface,while in longitudinal sections,the hardness of copper after the extrusion increased far away from interface of CuW80/Cu.The results of TEM observation showed that there were still some dislocation tangles even though the extrusion was small,and cell dislocation structures formed after serious extrusion.
中图分类号 TF12 TM503
所属栏目
基金项目 福建省产学研基金资助项目(闽产学研[2004]02-1)
收稿日期 2006/5/19
修改稿日期 2006/7/18
网络出版日期
作者单位点击查看
备注杨开怀(1980- ),男,福建泉州人,博士研究生.
引用该论文: YANG Kai-huai,HUANG You-ting,CHEN Wen-zhe. Copper Strengthening of CuW80/Cu Integrated Contact Material[J]. Materials for mechancial engineering, 2007, 31(4): 43～47
杨开怀,黄友庭,陈文哲. CuW80/Cu整体式触头尾部铜强化规律[J]. 机械工程材料, 2007, 31(4): 43～47
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【3】钱宝光,耿浩然,郭忠全,等.电触头材料的研究进展与应用[J].机械工程材料,2004,27(10):7-9.
【4】范志康,梁淑华,肖鹏.Cu-W/Cr-Cu自力型整体触头界面还原及结合强度[J].电工材料,2003,28(3):13-17.
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【11】谢忠光.电触头材料硬度试验方法及注意事项[J].电工材料,2004(4):39-42.
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