定向凝固技术制备多孔铜及其力学性能
Fabrication and Mechanical Properties of Porous Metal Copper with Upward Directional Solidification
摘 要
利用铜与氢在高温下发生的共晶反应,采取定向凝固的方法制备出孔隙率大于15%的多孔铜基材料,并研究了其显微组织和力学性能.结果表明:只有在高压力下发生的共晶反应才能制备出沿凝固方向生长的细长孔隙和沿垂直于凝固方向呈规则圆形分布的多孔材料,其抗拉强度较其它方法制备的高2~3倍,而且气孔的存在能较好地吸收弹性能.
共晶反应
多孔金属铜
力学性能
directional solidification
eutectic growth
porous metal copper
mechanical property
Abstract
Porous copper with high-porosity was fabricated by the directional solidification and eutectic reaction of copper hydrogen at high temperature and high pressure.The structure and mechanical properties of porous copper were investigated.The results show that the pores are slots along the directional solidification and regular circles distributed uniformly along the direction of diameter.The tensile strength of porous copper with gas-solid eutectic growth is two or three times higher than that of the material prepared with other technologies.The absorbed elasticity energy of porous copper is better than that of the pure copper.
中图分类号 TG139
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收稿日期 2006/9/22
修改稿日期 2006/12/25
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备注陈文革(1969-),男,陕西澄城人,副教授,博士.
引用该论文: CHEN Wen-ge,LUO Qi-wen,ZHANG Qiang,GAO Li-na. Fabrication and Mechanical Properties of Porous Metal Copper with Upward Directional Solidification[J]. Materials for mechancial engineering, 2007, 31(7): 42～44
陈文革,罗启文,张强,高丽娜. 定向凝固技术制备多孔铜及其力学性能[J]. 机械工程材料, 2007, 31(7): 42～44
被引情况:
【1】王清周,李诺,王倩,吴爱忠,崔春翔, "以NaCl为造孔剂制备开孔多孔铜的孔隙形貌及压缩性能",机械工程材料 35, 53-56(2011)
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参考文献
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【2】Banhart J.Manufacture,characterisation and application of cellular metals and metal foams[J].Progr Mater Sci,2001,46:559-632.
【3】刘培生,李铁藩,傅超,等.多孔金属材料的应用[J].功能材料,2002,32(1):12-15.
【4】李言祥,刘 源.GASAR和Gasarite研究进展[J].特种铸造及有色合金,2004(1):9-11.
【5】张华伟,李言祥.Gasar工艺中金属-氢二元相图的研究[J].金属学报,2005,41(1):55-59.
【6】李言祥,刘源.金属/气体共晶定向凝固规则多孔金属的研究进展[J].材料导报,2003,17(4):1-5.
【7】Simone A E,Gibson L J.The tensile strength of porous copper made by the gasar process[J].Acta Mater,1996,44(4):1437-1447.
【8】刘培生.泡沫金属力学性能的若干问题[J].稀有金属材料与工程,2004,33(5):474-477.
【9】Wolla J M,Provenzano V.Mechanical properties of gasar porous copper[J].Materials Research Society,1995,371:377-382.
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