Dynamic Recrystallization Behavior of CuNiSiP Alloy
摘 要
在Gleeble-1500D热模拟试验机上对CuNiSiP合金在高温压缩变形中的流变应力和组织变化进行了研究,分析了其再结晶行为.结果表明:应变速率和变形温度对合金的再结晶影响较大,在0.1,0.01 s-1应变速率下,650 ℃以上即可发生再结晶,而在1,5 s-1应变速率下,700 ℃以上才能发生再结晶;变形温度越高、应变速率越小,合金越容易发生再结晶;利用Arrhenius双曲正弦函数求得CuNiSiP合金的热变形激活能Q为485.6 kJ·mol-1.
Abstract
The flow stress behavior and microstructure change of CuNiSiP alloy during hot compression deformation process were studied by isothermal compression test on Gleeble-1500D thermal-mechanical simulator.The results show that both strain rate and deforming temperature had great effect on the dynamic recrystallization of the alloy.When the strain rates were 0.1 and 0.01 s-1,recrystallization could happened when the temperature was higher than 650 ℃.However,when the strain rates were 1 and 5 s-1,the recrystallization could happened only when the temperature was higher than 700 ℃.The higher the temperature,and the smaller the strain rate,the easier the dynamic recrystallization.The hot deformation activation energy of the CuNiSiP alloy was gained by Arrhenius hyperbolic sine function to be Q=485.6 kJ·mol-1.
中图分类号 TG146.1 TG113.2
所属栏目 物理模拟与数值模拟
基金项目 国家863计划资助项目(2006AA03Z528);国家自然科学基金资助项目(50571035);河南省杰出青年基金资助项目(0521001200)
收稿日期 2007/11/13
修改稿日期 2008/3/19
网络出版日期
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备注李银华(1982-),女,河南西华人,硕士研究生.
引用该论文: LI Yin-hua,LIU Ping,JIA Shu-guo,ZHANG Yi,TIAN Bao-hong,REN Feng-zhang. Dynamic Recrystallization Behavior of CuNiSiP Alloy[J]. Materials for mechancial engineering, 2008, 32(11): 82~85
李银华,刘平,贾淑果,张毅,田保红,任凤章. CuNiSiP合金的动态再结晶行为[J]. 机械工程材料, 2008, 32(11): 82~85
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【3】张红钢,张辉,彭大暑,等.KFC铜合金热压缩变形流变应力[J].热加工工艺,2004(1):121-24.
【4】李红英,欧 玲,张建飞,等.一种新型Al-Cu-Li系合金的热压缩流变应力[J].北京科技大学学报,2006,28(8):750-754.
【5】Bardi F,Cabibbo M.An analysis of hot deformation of an Al-Cu-Mg alloy produced by power metallurgy[J].Mater Sci Eng A,2003,339(1/2):43-53.
【6】王战锋,张辉,张昊,等.喷射沉积5A06铝合金热压缩变形的流变应力行为[J].中国有色金属学报,2006,11(16):1938-1944.
【7】Zener C,Hollomon J H.Problems in non-elasticdeformation of metals[J].J Apply Phys,1946,17(2):69-82.
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【10】Shen G,Semiatantin S L,Altan T.Investigation of flow stress and microstructure development in non-isothermal forging of Ti-6242[J].J Mater Process Technol,1993,36:303-307.
【11】Sellars C M,Tegart W J Mc G.Relation enter la resistance et al structure dans le deformation a chaud[J].Mem Sci Rev Metall,1966,63:731-746.
【12】Davenpot S B,Silk N J,Sparks C N,et al.Development of constitutive equations for modeling of hot rolling[J].Mater Sci and Technol,2000,16(5):539-546.
【13】Gao W,Belyakov A.Dynamic recrystallization of copper polycrystal with different purities[J].Materials Science and Engineering,1999,A265:233-236.
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