80Au-20Sn钎料焊点可靠性研究现状与展望
Research Status and Prospect for 80Au-20Sn Solder Joint Reliability
摘 要
共晶80Au-20Sn钎料在大功率电子及光电子器件封装中作为密封和芯片焊接材料特别具有吸引力,在这些应用中焊点的可靠性对于满足设备长期稳定运行至关重要.简要回顾了钎料焊点可靠性提出的背景,介绍了焊点可靠性的评价方法及当前不同工艺对80Au-20Sn钎料焊点的影响;指出今后其可靠性研究重点主要集中在复杂服役条件下焊接工艺优化、焊点可靠性测试方法、焊点寿命预测模型以及焊点本构模型等方面.
焊点
可靠性
测试方法
80Au-20Sn solder
solder joint
reliability
testing method
Abstract
Eutectic 80Au-20Sn solder alloy is particularly attractive for high-power electronics and optoelectronics packaging as the hermetic sealing and die attachment material.The reliability of solder joint is essential to meet the global demand for long operating lifetime in their applications.The research background of 80Au-20Sn solder joint is briefly reviewed first,and then the reliability assesment methods and the effects of different crafts are introduced.It is pointed that the focus of the study would be the process optimization,the reliability testing methods,the life prediction model and the constitutive model under complex service conditions.
中图分类号 TB114.3 TG407
所属栏目 综述
基金项目 国家自然科学基金资助项目(50575160);教育部高等学校博士点基金资助项目(20050056035)
收稿日期 2008/10/29
修改稿日期 2009/5/26
网络出版日期
作者单位点击查看
备注张国尚(1977-),男,河北滦南人,工程师,博士研究生.
引用该论文: ZHANG Guo-shang,JING Hong-yang,XU Lian-yong,HAN Yong-dian. Research Status and Prospect for 80Au-20Sn Solder Joint Reliability[J]. Materials for mechancial engineering, 2009, 33(11): 1～4
张国尚,荆洪阳,徐连勇,韩永典. 80Au-20Sn钎料焊点可靠性研究现状与展望[J]. 机械工程材料, 2009, 33(11): 1～4
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参考文献
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【2】CHROMIK R R,WANG D N,SHUGAR A,et al.Mechanical properties of intermetallic compounds in the Au-Sn system[J].Journal of Materials Research,2005,20(8):2161-2172.
【3】TEW J W R,SUN Y F,WEI J,et al.Thermo-mechanical and creep behaviors of Au/Sn solder alloy[C]//Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition,IMECE2006-Electronic and Photonics Packaging.Chicago:ASME,2006:1-5.
【4】BOWER A F,FLECK N A,NEEDLEMAN A,et al.Indentation of a power law creeping solid[C]//Proceedings of the Royal Society of London,Series A.London:Royal Society of London:1993:97-124.
【5】陈尚达,柯孚久.纳米硬度测量中接触面积及压头曲率半径效应的分子动力学模拟[J].中国科学:G辑,2003,33(5):400-410.
【6】SUN Y,LIANG J,XU Z H,et al.Nanoindentation for mea-suring individual phase mechanical properties of lead free solder alloy[J].Journal of Materials Science: Materials in Electronics,2008,19:514-521.
【7】MORGAN H S.Thermal stresses in layered.electrical assemblies bonded with solder[J].ASME Journal.of Electronic Packaging,1995,113:350-354.
【8】LIU Y C,TEO J W R,TUNG S K,et al.High-temperature creep and hardness of eutectic 80Au-20Sn solder[J].Journal of Alloys and Compounds,2008,448(1/2):340-343.
【9】ZHANG G S,JING H Y,XU L Y,et al.Creep behavior of eutectic 80Au-20Sn solder alloy[J].Journal of Alloys and Compounds,2009,476(1/2):138-141.
【10】KUANG J H,SHEEN M T,CHANG C F H,et al.Effect of temperature cycling on joint strength of PbSn and AuSn solders in laser packages[J].IEEE Transactions on Advanced Packaging,2001,24(2):563-568.
【11】DUDEK R,WITTLER O,FAUST W,et al.Design for reliability with AuSn interconnects[C]//Proceedings of the 8th International Conference on Thermal,Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.London: IEEE,2007:378-384.
【12】ELLIS D S,XU J M.Electro-opto-thermal modeling of threshold current dependence on temperature[J].IEEE Journal of Selected Topics in Quantum Electronics,1997,3(2):640-648.
【13】SWEENEY S J,LYONS L J,ADAMS A R,et al.Direct measurement of facet temperature up to melting point and COD in high-power 980-nm semiconductor diode lasers[J].IEEE Journal of Selected Topics in Quantum Electronics,2003,9(5):1325-1332.
【14】JIANG W.A new approach of creating Au-Sn solder bumps from electroplating[J].Crystal Research and Technology,2006,41(2):150-153.
【15】TEO J W R,SHI X Q,YUAN S,et al.Modified face-down bonding of ridge-waveguide lasers using hard solder[J].IEEE Transactions on Electronics Packaging Manufacturing,2008,31(2):159-167.
【16】KIM J S,CHOI W S,KIM D W,et al.Fluxless silicon-to-alumina bonding using electroplated Au-Sn-Au structure at eutectic composition[J].Materials Science and Engineering A,2007,458(1/2):101-107.
【17】YOON J W,CHUN H S,JUNG S B.Reliability evaluation of Au-20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au[J].Materials Science and Engineering A,2008,473(1/2):119-125.
【18】SHI X Q,WANG Z P,YANG Q J,et al.Creep behavior and deformation mechanism map of Sn-Pb eutectic solder alloy[J].J Eng Mater Technol Trans ASME,2003,125(1):81-88.
【19】WEN S M,KEER L M,VAYNMAN S,et al.A constitutive model for a high lead solder[J].IEEE Trans Compon Packag Technol,2002,25(1):23-31.
【20】CHEN X,CHEN G,SAKANE M.Prediction of stress-strain relationship with an improved Anand constitutive Model For lead-free solder Sn-3.5Ag[J].IEEE Trans Compon Packag Technol,2005,28(1):111-116.
【21】PEI M,QU J.Constitutive modeling of lead-free solders[C]//Proceedings of the 10th International Symposium on Advanced Packaging Materials: Processes,Properties and Interfaces.Piscataway: IEEE,2005:45-49.
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