讨论了BGA封装器件焊接的特点, 并对BGA封装器件焊点检测方法进行了阐述。采用X射线检测法, 通过图像处理技术检测每个焊点的面积、质心和圆度, 以此来判断焊点是否有漏焊、焊锡球、桥连、焊球过大或过小、偏移以及焊球变形等缺陷。试验证明, 所用系统可以快速、准确地检测出BGA封装器件中常见的焊点缺陷, 为BGA封装器件焊点的质量提供保障。

The soldering characteristics of BGA package components were discussed and the inspection methods used in the BGA package components were summarized.The X-ray detection was used, then the area, centroid coordinate and roundness of each solder ball could be accurately estimated by using of the image processing technology. Hence, the defects of BGA solder joint, such as missing ball, extra ball, ball bridging, oversize or undersize, offset and deformation could be detected. The experiment proved that the system could fast and accurately detect the familiar defects of the BGA package components and guarantee the quality.