钢渗铬层上金刚石薄膜的表面、界面结构及附着性
SURFACE,STRUCTURE OF INTERFACE AND ADHESION OF DIAMOND FILMS DEPOSITED ON CHROMIZED LAYER OF A STEEL
摘 要
在钢渗铬层表面用化学气相沉积(CVD)法制备了金刚石薄膜。使用扫描电镜(SEM)、透射电镜(TEM)和压痕法研究了金刚石膜的表面、界面结构及附着力。用拉曼光谱分析了金刚石膜的纯度及非金刚石碳相。甲烷含量超过0.6%(体积分数)后,金刚石膜为球形纳米晶,形核密度>107cm-2。用甲烷含量为0.6%(体积分数)沉积的金刚石膜表面的残余压应力为1.22 GPa,而膜背面的残余压应力更高,达2.61 GPa。压痕显示在19.6 N载荷下膜发生开裂。TEM观察发现,膜/基界面为微观非平面,有利于提高金刚石膜的附着力。
金刚石膜
渗铬钢
界面
附着力
Chemical vapor deposition (CVD)
Diamond film
Chromized steel
Interface
Adhesion
Abstract
CVD diamond films were deposited on the chromized layer of a steel. The surface,the structure of interface and the adhesion of the films were investigated using scanning electron microscopy,transmission electron microscopy (TEM) and indention tests. The diamond purity and interfacial phases were evaluated with Raman Spectroscopy. When the CH4∶H2 ratio is higher than 0.6%,diamond film is composed of spherical nanograins,and the nucleus density is larger than 107cm-2. The residual compressive stress on the surface of diamond film synthesized at 0.6% CH4 is 1.22 GPa,lower than that of the film back,2.61 GPa. The film cracks at 19.6 N load in indention tests. TEM observation indicates the film/substrate interface is micro-rough and thus beneficial to adhesion.
中图分类号 O484.1
所属栏目 试验与研究
基金项目 广东省自然科学基金项目(013004,04300026)
收稿日期 2006/12/29
修改稿日期
网络出版日期
作者单位点击查看
备注黄元盛(1969-),男,副教授,博士。
引用该论文: HUANG Yuan-sheng,QIU Wan-qi,LUO Cheng-ping,LIU Hong-wei,CHEN Ling. SURFACE,STRUCTURE OF INTERFACE AND ADHESION OF DIAMOND FILMS DEPOSITED ON CHROMIZED LAYER OF A STEEL[J]. Physical Testing and Chemical Analysis part A:Physical Testing, 2007, 43(5): 217～220
黄元盛,邱万奇,罗承萍,刘宏伟,陈 灵. 钢渗铬层上金刚石薄膜的表面、界面结构及附着性[J]. 理化检验－物理分册, 2007, 43(5): 217～220
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参考文献
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【4】Windischmann H,Epps G F,Cong Y,et al. Intrinsic stress in diamond films prepared by microwave plasma CVD［J］. J Appl Phys,1991,69(4):2231-2237．
【5】Chii R L,Cheng T K. High adhesion and quality diamond films on steel substrate［J］. Diamond and Related Materials,1998,7(6):903-907．
【6】Buijnsters J G,Shankar P,Fleischer W,et al. Meulen. CVD diamond deposition on steel using arc-plated chromium nitride Interlayers［J］. Diamond and Related Materials,2002,11(3/6):536-544．
【7】Gluzman O,Berner A,Shechtman D,et al. Influence of Cr-N interlayer properties on the initial stages of CVD diamond growth on steel substrates［J］. Diamond and Related Materials,1998,7(2/5):597-602．
【8】Zhang H X,Jiang Y B,Yang S Z,et al. Diamond growth on steel substrates with Al-N interlayer produced by high power plasma streams［J］. Thin Solid Films,1999,349(1-2):162-164．
【9】Ralchenko V G,Smolin A A,Pereverzev V G,et al. Diamond deposition on steel with CVD tungsten intermediate layer［J］. Diamond and Related Materials,1995,4:754-758．
【10】Campillo C,Ilias S,Borges C F M,et al. Enhanced diamond film adhesion on cobalt-cemented WC substrates［J］. New Diamond and Frontier Carbon Technology,2001,11(2):147-155．
【11】Borges C F M,Pfender E,Heberlein J,et al. Adhesion improvement of diamond films on molybdenum rod substrates using metallic powder［J］. Diamond and Related Materials,1998,7(9):1351-1356．
【12】Lin T,Loh K P,Wee A T S,et al. High resolution transmission electron microscopy study of the initial growth of diamond on silicon［J］. Diamond and Related Materials,2000,9(9/10):1703-1707．
【13】Jiang N,Wang C L,Won J H,et al. Interface characterization of chemical-vapour-deposited diamond on Cu and Pt substrates studied by transmission electron microscopy［J］. Applied Surface Science,1997,117/118:587-591．
【14】Alam M,Peeble D E s,Tallant D R. Diamond deposition onto WC–6%Co cutting Tool Material: Coating Structure and Interfacial Bond Strength［J］. Thin Solid Films,1997,300:164-170．
【15】Tallant D R,Parmeter J E,Siegal M P,et al. The thermal stability of diamond-like carbon［J］. Diamond and Related Materials,1995,4:191-199．
【16】Huang Y S,Qiu W Q,Luo C P. Effect of molybdenum on diamond deposition and adhesion［J］. Thin Solid Films,2005,472(1/2):20-25．
【17】邹敢锋,黄元盛,袁叔贵.T10钢低温盐浴渗铬工艺的研究［J］.金属热处理,2000,25(4):28-29．
【18】Boppart H,Straaten J V,Silvera I F. Raman spectra of diamond at high pressures［J］. Physical Review B,1985,32:1423-1425．
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