63Sn-37Pb和Sn-0.7Cu钎料的力学性能
MECHANICAL CHARACTERIZATION OF 63Sn-37Pb AND Sn-0.7Cu SOLDERS
摘 要
对63Sn-37Pb和Sn-0.7Cu两种钎料进行了单轴拉伸试验、纯扭试验和纯扭疲劳试验。结果表明,钎料拉伸和纯扭时的应力应变关系有很强的应变速率相关性。弹性模量和剪切模量受应变速率的影响很小。钎料的屈服强度、剪切屈服强度、抗拉强度和抗剪强度也受应变速率的影响。钎料是剪切型破坏材料,并且发生循环软化。
Sn-0.7Cu
应变速率
单轴拉伸
纯扭
疲劳
63Sn-37Pb
Sn-0.7Cu
Strain rate
Uniaxial tension
Pure torsion
Fatigue
Abstract
The uniaxis tension and pure torsional tests in addition with torsional fatigue tests were conducted on 63Sn-37Pb and Sn-0.7Cu. The results show that the stress-strain relationship,yield stress,shear yield stress,tensile strength,shear strength of the solders have strong strain rate-dependence. But the elastic modulus and shear modulus do not have apparent strain rate dependent effect. The two solders belong to shear-type fracture materials,and the cyclic softening effect occurs under cyclic loading conditions.
中图分类号 TG146.1+4
所属栏目 试验与研究
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引用该论文: CHEN Gang,CHEN Xu,BAI Ning,LI Xin. MECHANICAL CHARACTERIZATION OF 63Sn-37Pb AND Sn-0.7Cu SOLDERS[J]. Physical Testing and Chemical Analysis part A:Physical Testing, 2007, 43(6): 271～274
陈 刚,陈 旭,白 宁,李 鑫. 63Sn-37Pb和Sn-0.7Cu钎料的力学性能[J]. 理化检验－物理分册, 2007, 43(6): 271～274
被引情况:
【1】陈 刚,陈 旭,白 宁,李 鑫, "考虑棘轮效应的疲劳寿命预测方法",理化检验－物理分册 43, 342-345(2007)
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参考文献
【1】黄惠珍,魏秀琴,周 浪.无铅钎料及其可靠性的研究进展［J］.电子元件与材料,2003,22(4):39-42．
【2】Abtew M,Selvaduray G. Lead-free solders in microelectronics［J］. Materials Science and Engineering,2000,27:95-141．
【3】ASTM E606-1998 Standard practice for strain-controlled fatigue testing［S］．
【4】李 鑫,陈 旭,白 宁,等.微型拉扭疲劳试验机及其控制系统［J］.理化检验-物理分册,2006,42(1):45-47．
【5】Pang H L J,Xiong B S,Low T H. Low cycle fatigue study of lead free 99.3Sn-0.7Cu solder alloy［J］. International Journal of Fatigue,2004,26:865-872．
【2】Abtew M,Selvaduray G. Lead-free solders in microelectronics［J］. Materials Science and Engineering,2000,27:95-141．
【3】ASTM E606-1998 Standard practice for strain-controlled fatigue testing［S］．
【4】李 鑫,陈 旭,白 宁,等.微型拉扭疲劳试验机及其控制系统［J］.理化检验-物理分册,2006,42(1):45-47．
【5】Pang H L J,Xiong B S,Low T H. Low cycle fatigue study of lead free 99.3Sn-0.7Cu solder alloy［J］. International Journal of Fatigue,2004,26:865-872．
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