电沉积铜薄膜中的内应力与织构特征
CHARACTERISTIC OF INTERNAL STRESS AND TEXTURE IN ELECTROPLATED COPPER THIN FILMS
摘 要
利用X射线衍射方法分析了电沉积铜薄膜的内应力及其织构特征。结果表明,随薄膜厚度的增加,薄膜内应力增大。电沉积铜薄膜具有较强的(220)丝织构,随着铜薄膜内应力的增加,(220)丝织构增强,同时叠加有板织构的特征。
X射线衍射
内应力
织构
Electroplated copper thin film
XRD
Internal stress
Texture
Abstract
The characteristic of texture and internal stress of electroplated copper thin films were studied using X-ray diffraction (XRD) analysis. The results showed that the electroplated copper thin films had highly preferred orientations of (220). The (220) fiber-texture of copper thin films became strong with increasing internal stress. At a critical film thickness,the copper thin films exhibited character of planar texture.
中图分类号 O484.2
所属栏目 试验与研究
基金项目 上海-应用材料科技合作基金(0412)
收稿日期 2006/11/30
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备注洪 波(1978-),男,博士研究生。
引用该论文: HONG Bo,JIANG Chuan-hai,WANG Xin-jian. CHARACTERISTIC OF INTERNAL STRESS AND TEXTURE IN ELECTROPLATED COPPER THIN FILMS[J]. Physical Testing and Chemical Analysis part A:Physical Testing, 2007, 43(8): 392～394
洪 波,姜传海,王新建. 电沉积铜薄膜中的内应力与织构特征[J]. 理化检验－物理分册, 2007, 43(8): 392～394
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参考文献
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【4】张建民,徐可为,张美荣.薄膜中异常晶粒生长理论及能量各向异性分析 ［J］.物理学报,2003,52:1207．
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【6】Zhang J M,Xu K W,He J W. Effects of grain orientation of preferred abnormal grain growth in copper films on silicon substrates［J］. J Mater Sci Lett,1999,18:471．
【7】周 浪,周耐根,朱圣龙.内应力对金属薄膜生长织构的影响 ［J］.金属学报,2002,38:795．
【2】Smith D L. Thin Film Deposition［M］. New York: McGraw Hill Inc,1995:156．
【3】Hong B,Jiang C H,Wang X J. Texture of electroplated copper film under biazial stress［J］. Materials Transactions,2006,47:2299．
【4】张建民,徐可为,张美荣.薄膜中异常晶粒生长理论及能量各向异性分析 ［J］.物理学报,2003,52:1207．
【5】Zhou L,Zhu S L. Development of a strain induced planar film texture as revealed by molecular dynamics simulation［J］. Scripta Materialia,2002,47:677．
【6】Zhang J M,Xu K W,He J W. Effects of grain orientation of preferred abnormal grain growth in copper films on silicon substrates［J］. J Mater Sci Lett,1999,18:471．
【7】周 浪,周耐根,朱圣龙.内应力对金属薄膜生长织构的影响 ［J］.金属学报,2002,38:795．
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