利用铜模铸造法分别制备了两种不同成分的快凝铜锡合金, 利用XRD分析了该快凝合金的物相结构, 用四探针法测量了两种快凝铜锡合金的电阻率, 并通过动电位极化曲线和电化学阻抗谱研究了两种快凝合金在NaOH溶液中的电化学耐腐蚀性能。结果表明, Cu75Sn25快凝合金具有Cu3Sn相, 而Cu65Sn35快凝合金主要具有Cu6Sn5相及部分Cu3Sn相, 由于两种快凝合金均形成了金属间化合物, 其电阻率没有明显区别; 在NaOH溶液中, Cu65Sn35快凝合金的耐蚀性明显优于Cu75Sn25快凝合金的。

Two rapidly solidified CuSn alloys were prepared by copper mold casting. The phase composition and electronic resistivity of the two alloys were analyzed by XRD and four-probe method. And the corrosion behaviors of the alloys in NaOH solution were also studied by potentiodynamic polarization and electrochemical impedance spectroscopy (EIS). The results show that the phase of the rapidly solidified Cu75Sn25 alloy was Cu3Sn while the rapidly solidified Cu65Sn35 consisted of Cu6Sn5 and Cu3Sn. Due to the formation of intermetallic compounds, the electronic resistances were nearly the same for the two alloys. The rapidly solidified alloy Cu65Sn35 had more excellent corrosion resistance than rapidly solidified alloy Cu75Sn25 in 0.1 mol/L NaOH solution.