采用水滴试验，研究了表面处理工艺（有机保焊膜、浸锡和化学镍金）对BT树脂基板、陶瓷基板和FR-4基板表面电化学迁移的影响。结果表明：经有机保焊膜与浸锡表面处理工艺的试样的电化学迁移机理符合经典电化学迁移模型；经化学镍金表面处理工艺的试样的电化学迁移则表现为阳极晶枝生长，溶液中生成的镍的氧化物和氢氧化物的溶解性是阳极晶枝生长的关键因素；三种表面处理对电化学迁移的抵抗力由强变弱依次为：化学镍金，有机保焊膜和浸锡；针对采用化学镍金表面处理工艺的试样，陶瓷基板对电化学迁移的抵抗力优于FR-4基板的，而采用另外两种表面处理工艺时，基板对电化学迁移的抵抗力表现一致，由强变弱依次为：BT树脂基板，陶瓷基板和FR-4基板。

Water drop tests were used to investigate the effect of three common surface treatment processes (organic solder mask, immersion tin, and electroless nickel gold) on electrochemical migration (ECM) of BT resin substrates, ceramic substrates, and FR-4 substrates. The results showed that the ECM mechanism of the samples with organic solder mask and immersion tin surface treatment accorded with the classical ECM model; the ECM of the samples with chemical nickel gold surface treatment process showed the growth of anodic susceptor. The solubility of nickel oxides and hydroxides formed in the solution was a key factor in the growth of the anodic lattice. The resistance of the three kinds of surface treatment to the electrochemical migration from strong to weak was:chemical nickel gold, organic solder mask and immersion tin. For the sample using the chemical nickel gold surface treatment process, the resistance of the ceramic substrate to the electrochemical migration was superior to that of the FR-4 substrate, and for the other two surface treatment processes, the resistance of the substrate to the ECM was consistent, from strong to weak were:BT resin substrate, ceramic substrate and FR-4 substrate.