助剂对丁苯橡胶基高频覆铜层压板性能的影响
Effect of Additives on Properties of Styrene-butadien Rubber Based High Frequency Copper Clad Laminate
摘 要
采用高乙烯基含量的丁苯橡胶与3种不同含乙烯基结构的单体（助剂）作为覆铜层压板的树脂基体，研究了不同含量的丁苯橡胶对3种不同体系覆铜层压板性能的影响。结果表明：二乙烯基苯（DVB）体系的覆铜层压板介电性能最佳，最小介电常数和介电损耗分别达到3.33和0.002 4，同时吸水率最小为0.024%；三烯丙基异氰脲酸酯（TAIC）体系的覆铜层压板具有较高的玻璃化温度，最高可达248℃，同时弯曲强度最高为351 MPa。
乙烯基树脂
覆铜层压板
介电性能
styrene butadiene rubber
vinyl resin
copper clad laminate
dielectric property
Abstract
Using high content of vinyl styrene-butadiene rubber with three different structure of vinyl monomer (additives) as the resin matrix of copper clad laminate. The effects of different content styrene butadiene rubber on the properties of three different systems of copper clad laminates were studied. The results show that the dielectric properties of copper clad laminates with DVB system were the best, the minimum dielectric constant and dielectric loss were 3.33 and 0.002 4, respectively, and the minimum water absorption was 0.024%. The copper clad laminates with TAIC system had higher glass transition temperature up to 248 ℃, and bending strength up to 351 MPa.
中图分类号 TQ322.4.1 DOI 10.11973/lhjy-wl202106008
所属栏目 试验与研究
基金项目
收稿日期 2020/8/24
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备注段家真(1987-),男,工程师,主要从事高频覆铜板基体树脂的研究及应用,duanjiazhen@163.com
引用该论文: DUAN Jiazhen,JIN Shilei,MA Fengling,NIE Ya,LI Xiaohui. Effect of Additives on Properties of Styrene-butadien Rubber Based High Frequency Copper Clad Laminate[J]. Physical Testing and Chemical Analysis part A:Physical Testing, 2021, 57(6): 38～41
段家真,金石磊,马峰岭,聂娅,李小慧. 助剂对丁苯橡胶基高频覆铜层压板性能的影响[J]. 理化检验－物理分册, 2021, 57(6): 38～41
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参考文献
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【3】程静,陈良,吴培常,等.介电常数对PCB板性能影响的四个方面[J].印制电路信息,2012(9):42-48.
【4】WANG C, WEN N, ZHOU G, et al. Incorporation of tin on copper clad laminate to increase the interface adhesion for signal loss reduction of high-frequency PCB lamination[J].Applied Surface Science,2017,422(15):738-744.
【5】何平笙.新编高聚物的结构与性能[M].北京:科学出版社,2009.
【6】赵旭涛,刘大华.合成橡胶工业手册[M].北京:化学工业出版社,2006.
【7】WENG L, ZHANG Y C, ZHANG X R, et al. Synthesis and properties of cyanate mixed resin systems modified by polyphenylene oxide for production of high frequency copper clad laminates[J].Journal of Materials Science-materials in Electronics,2018,29(4):2831-2840.
【8】HASEGAWA M, TAKAHASHI S, TSUKUDA S, ET AL. Symmetric and asymmetric spiro-type colorless poly (ester imide) s with low coefficients of thermal expansion, high glass transition temperatures. And excellent solution processability[J].Polymer,2019,169:167-184.
【9】苏志忠,陈朝晖,王迪珍.助交联剂TAC和TAIC对EPDM过氧化物硫化的影响[J].橡胶工业,2000,47(10):594-597.
【10】MENG J R, LIANG G Z, ZHAO L. Study on epoxy matrix modified with poly (2, 6-dimethyl-1, 4-phenylene ether) for application to copper clad laminate[J].Composites Science and Technology,2002,62:783-789.
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