Application Progress of Corrosion Protection for Electronic and Electrical Equipment in Coastal Space Launch Sites
摘 要
针对海洋大气环境中滨海航天发射场电子电气设备腐蚀防护的应用需求,结合电子电气设备所处的湿热、霉菌、盐雾环境,介绍了电子电路涂层防护技术和电子设备环境控制保护技术及其应用。传统的三防漆(胶)涂覆防护技术是常规电子电路防护技术,纳米涂层防护体系适用于高端关键电子设备的防护;内循环盐雾控制技术通常应用于防护要求高、设备数量多且较为密封的工作间,气相缓蚀剂适用于密闭小空间内电子电气防腐蚀。最后,针对滨海发射场电子电气设备腐蚀防护的实际应用,提出进行典型电子电气设备的可靠性与寿命评价的建议。
Abstract
According to the actual requirements of corrosion protection for electronic and electrical equipment in coastal space launch sites in the environment of marine atmosphere, coating protection technology for electronic circuit and environmental control protection technology for electronic equipment are introduced as well as their applications, in combination with the humid and hot environment containing mold and salt fog. Traditional threeproof paint (glue) coating protection technology is the conventional electronic circuit protection technology. Nanocoating protection system is suitable for the protection of high-end key electronic equipment. Internal circulation salt spray control technology is usually applied to the workplaces with high protection requirements, large number of equipment, and relatively sealed conditions. And vapor phase corrosion inhibitor technology is suitable for the corrosion protection for electronic and electrical appliances in a confined small space. Finally, according to the application of electrical and electronic equipment in coastal space launch sites, some suggestions are put forward to evaluate the reliability and life of typical electronic and electrical equipment in coastal space launch sites.
中图分类号 X949 DOI 10.11973/fsyfh-202203001
所属栏目 专论
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收稿日期 2020/6/6
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引用该论文: YANG Bo,ZHONG Wenan,TANG Gongjian,WANG Honglun,LIU Zhaojin,ZHANG Zaijing. Application Progress of Corrosion Protection for Electronic and Electrical Equipment in Coastal Space Launch Sites[J]. Corrosion & Protection, 2022, 43(3): 1
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【2】常可可,王立平,薛群基. 极端工况下机械表面界面损伤与防护研究进展[J]. 中国机械工程,2020,31(2):206-220.
【3】KHATRI B R,SODHA A B,SHAH M B,et al. Chemical and microbial leaching of base metals from obsolete cell-phone printed circuit boards[J]. Sustainable Environment Research,2018,28(6):333-339.
【4】CHURCHILL P G. Special requirements for demanufacturing of military electronics[C]// ISEE'03:Proceedings of the Electronics and the Environment,2003. on IEEE International Symposium. Washington,DC:IEEE Computer Society,2003:94-98.
【5】李琳,朱小飞,杨科,等. 国内外战术导弹外防护涂层技术现状与发展趋势[J]. 航空制造技术,2016,59(14):47-51.
【6】Insulating Compound,Electrical (For Coating Printed Circuit Assemblies):MIL-I-46058C[S]. [S.l]:[s.n.],1998.
【7】Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies:IPC-CC-830C[S]. [S.l]:[s.n.],2018.
【8】DING J H,RAHMAN O U,PENG W J,et al. A novel hydroxyl epoxy phosphate monomer enhancing the anticorrosive performance of waterborne graphene/epoxy coatings[J]. Applied Surface Science,2018,427:981-991.
【9】RAMEZANZADEH B,AHMADI A,MAHDAVIAN M. Enhancement of the corrosion protection performance and cathodic delamination resistance of epoxy coating through treatment of steel substrate by a novel nanometric sol-gel based silane composite film filled with functionalized graphene oxide nanosheets[J]. Corrosion Science,2016,109:182-205.
【10】RAMEZANZADEH B,NIROUMANDRAD S,AHMADI A,et al. Enhancement of barrier and corrosion protection performance of an epoxy coating through wet transfer of amino functionalized graphene oxide[J]. Corrosion Science,2016,103:283-304.
【11】刘丹,伍方,赵文杰,等. 环氧树脂防腐性能研究进展[J]. 中国材料进展,2015,34(11):852-861.
【12】AKIZUKI T,SHIBATA K. Co-polyester resin for molded product such as coat film and insulation protection film for electronic circuit card and liquid-crystal driver,is obtained by co-polymerizing dihydric phenol and aromatic dicarboxylic acid component:JPN2009046667-A[P]. 2009-03-05.
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【14】MOON H W,BONG D H,SUK S H. Dry film photoresist manufacturing method for printed circuit board utilized in electronics industry,involves coating and drying resin protection layer on side of film,and coating photosensitive resin layer on side of protection layer:KR2011077701-A[P]. 2011-06-07.
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【19】STADLER D,MUELLER D N,BREDE T,et al. Magnetic field-assisted chemical vapor deposition of iron oxide thin films:influence of field-matter interactions on phase composition and morphology[J]. The Journal of Physical Chemistry Letters,2019,10(20):6253-6259.
【20】BUTLER S. Vacuum deposition system for coating printed circuit board panels with copper,etc:WIPO9854375-A1[P]. 1998-12-03.
【21】PARK J C,LEE C,SONG D,et al. Coating apparatus for use in manufacturing of printed circuit board (PCB),has vacuum pump that discharges portion of monomer of deposition material not deposited from deposition chamber and generates fluid path for deposition material:US2014261183-A1[P]. 2014-09-18.
【22】PENG L. Hole drilling cover plate for circuit board drilling device,has insulating layer and conductive layer bonded in manner of electroplating,vacuum evaporation deposition or coating,where thickness of conductive layer is range:WIPO2019001273-A1[P]. 2019-01-03.
【23】熊建明,吉兴荣. 一种FPC柔性电路板镀膜工艺:201710853840.6[P]. 2018-01-16.
【24】LIU Z,MING Z M. Accelerated life assessment of coating on the radar structure components in coastal environment[J]. Journal of Applied Biomaterials & Functional Materials,2016,14(S1):24-28.
【25】CHEN Z,JUN W. The fog sedimentation rate control and simulation of salt spray system[C]//International Conference on Information Technology and Computer Science,3rd (ITCS 2011).[S.l.]:ASME Press,2011:226-229.
【26】鞠玉琳,李焰. 气相缓蚀剂的研究进展[J]. 中国腐蚀与防护学报,2014,34(1):27-36.
【27】ANSARI F A,VERMA C,SIDDIQUI Y S,et al. Volatile corrosion inhibitors for ferrous and non-ferrous metals and alloys:a review[J]. International Journal of Corrosion and Scale Inhibition,2018,7(2):126-150.
【28】LYUBLINSKI E,LYNCH P,ROYTMAN I,et al. Application experience and new approaches for volatile corrosion inhibitors[J]. International Journal of Corrosion and Scale Inhibition,2015,4(2):176-192.
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