退火温度对纳米晶铜微观结构和力学性能的影响
Influence of Annealing Temperature on Microstructure and Mechanical Properties of Nanocrystalline Copper
摘 要
采用电沉积法制备得到厚度约600 μm的块体纳米晶铜,并在100~250℃下进行退火处理,研究了退火温度对纳米晶铜微观结构和力学性能的影响。结果表明:未退火及退火后纳米晶铜均呈现面心立方结构;随着退火温度从100℃增加至250℃,纳米晶铜(200)晶面的衍射峰强度逐渐增强。随着退火温度的升高,纳米晶铜的抗拉强度逐渐减小,断后伸长率先增大后减小,表面拉伸变形带和拉伸断口上大而深的韧窝数量均增加;200℃退火后纳米晶铜的拉伸性能较佳,抗拉强度高约500 MPa,断后伸长率近30.5%。
热处理
力学性能
应变硬化
electrodeposition
heat treatment
mechanical property
strain hardening
Abstract
Bulk nanocrystalline copper with a thinkness of about 600 μm was prepared by electrodeposition, and then was annealed at 100-250℃. The effect of the annealing temperature on the microstructure and mechanical properties of the nanocrystalline copper was studied. The results show that both unannealed and annealed nanocrystalline copper showed a face-centered cubic structure. As the annealing temperature rose from 100℃ to 250℃, the diffraction peak intensity of (200) crystal faces of the nanocrystalline copper gradually increased. With the increase of annealing temperature, the tensile strength of the nanocrystalline copper gradually decreased while the elongation after fracture increased first and then decreased; and the numbers of both the surface tensile deformation zones and the large and deep dimples on the tensile fracture increased. The nanocrystalline copper had the relatively good tensile properties after annealing at 200℃, with the tensile strength up to about 500 MPa and the elongation after fracture of nearly 30.5%.
中图分类号 THK142 DOI 10.11973/jxgccl202208004
所属栏目 试验研究
基金项目
收稿日期 2021/5/17
修改稿日期 2022/5/30
网络出版日期
作者单位点击查看
备注刘林波(1994-),男,河南济源人,硕士研究生
引用该论文: LIU Linbo,CHEN Jiawen,SHEN Xixun. Influence of Annealing Temperature on Microstructure and Mechanical Properties of Nanocrystalline Copper[J]. Materials for mechancial engineering, 2022, 46(8): 22～27
刘林波,陈佳文,沈喜训. 退火温度对纳米晶铜微观结构和力学性能的影响[J]. 机械工程材料, 2022, 46(8): 22～27
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【3】WANG Z Y,CAI X L,YANG C J,et al.Improving strength and high electrical conductivity of multi-walled carbon nanotubes/copper composites fabricated by electrodeposition and powder metallurgy[J].Journal of Alloys and Compounds,2018,735:905-913.
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【5】YAMAMOTO T,IGAWA K,TANG H,et al.Effects of current density on mechanical properties of electroplated nickel with high speed sulfamate bath[J].Microelectronic Engineering,2019,213:18-23.
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【8】WANG G Y,JIANG Z H,JIANG Q,et al.Mechanical behavior of an electrodeposited nanostructured Cu with a mixture of nanocrystalline grains and nanoscale growth twins in submicrometer grains[J].Journal of Applied Physics,2008,104.
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【26】SHEN X X,WU M,JI D M,et al.The mechanical behavior of a layered nanostructured Ni with an alternating growth of ultrafine grains and nano-sized grains fabricated by electrodeposition[J].Materials Science and Engineering:A,2018,713:43-51.
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