Failure Mechanism of LED Chip in Human Sweat
摘 要
对含铝反射电极的半导体发光二极管LED芯片在人体汗液作用下的失效现象进行了研究。通过扫描电子显微镜(SEM)和X射线能谱仪(EDS),对失效样品不同区域的成分进行对比分析;通过模拟人体汗液污染试验,对优化电极工艺和结构后的芯片进行失效对比验证。结果表明:汗液中的卤素氯离子与电极中铝层发生电化学腐蚀,致使电极与外延层界面间黏附力降低,最终导致芯片电极脱离后失效。
Abstract
The failure phenomenon of semiconductor light emitting diode LED chips containing aluminum reflective electrodes under the action of human sweat was studied. Through scanning electron microscopy (SEM) and X-ray energy dispersive spectrascopy (EDS), the composition of different areas on the failed samples was analyzed contrastively. By simulating human sweat contamination test, the chip with optimized electrode process and structure was verified for comparison of failure. The results showed that the halogen chloride ions in sweat and the aluminum layer in the electrode were electrochemically corroded, which reduced the adhesion between the interface between the electrode and the epitaxial layer, and eventually led to the failure of the chip electrode after separation.
中图分类号 TN383+.1 TG174.3+6 DOI 10.11973/fsyfh-202211019
所属栏目 失效分析
基金项目 扬州市自然科学基金(Y2018095);扬州大学广陵学院教学改革研究项目(JGZD20003)
收稿日期 2021/3/12
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引用该论文: JIN Yuzhe,FU Chunhua,XIA Weiwei. Failure Mechanism of LED Chip in Human Sweat[J]. Corrosion & Protection, 2022, 43(11): 106
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参考文献
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【4】CHANG M H, DAS D, VARDE P V, et al.Light emitting diodes reliability review[J]. Microelectronics Reliability, 2012, 52(5):762-782.
【5】GAO W, EMAMINEJAD S, NYEIN H Y Y, et al.Fully integrated wearable sensor arrays for multiplexed in situ perspiration analysis[J]. Nature, 2016, 529(7587):509-514.
【6】陈才佳, 李珅, 王静辉, 等.具有反射电极的高亮度LED芯片设计[J]. 半导体技术, 2014, 39(5):361-364.
【7】李瑛, 张涛, 王福会.AZ91D镁合金手汗腐蚀机理研究[J]. 中国腐蚀与防护学报2004, 24(5):276-279.
【8】徐丽新, 胡津, 耿林, 等.铝的点蚀行为[J]. 宇航材料工艺, 2002, 32(2):21-24.
【9】张建堃, 陈国宏, 王家庆, 等.干/湿NaCl盐雾条件下钢芯铝绞(ACSR)导线腐蚀层结构及腐蚀机理[J]. 腐蚀与防护, 2010, 31(8):581-586, 599.
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