SiO2颗粒形貌及粒径对SiO2填充碳氢树脂覆铜板性能的影响
Effect of SiO2 Particle Morphology and Particle Size on Properties ofSiO2 Filled Hydrocarbon Resin Copper Clad Laminate
摘 要
以聚丁二烯为树脂基体，玻纤布为增强材料，SiO2为填料，采用浸渍及真空热压技术制备SiO2填充碳氢树脂覆铜板，研究了SiO2颗粒形貌（球形、角形）及粒径（2~20 μm）对覆铜板介电性能、弯曲强度、剥离强度和吸水率的影响。结果表明：在相同粒径下，与角形SiO2填充碳氢树脂覆铜板相比，球形SiO2填充碳氢树脂覆铜板的介电常数、介电损耗和吸水率较低，弯曲强度和剥离强度较高，综合性能更优异；随着SiO2粒径的增大，球形和角形SiO2填充碳氢树脂覆铜板的介电常数、介电损耗、弯曲强度和吸水率均降低，剥离强度升高。
碳氢树脂覆铜板
介电性能
剥离强度
吸水率
SiO2
hydrocarbon resin copper clad laminate
dielectric property
peeling strength
water absorption
Abstract
SiO2 filled hydrocarbon resin copper clad laminate was prepared by impregnation and vacuum hot pressing technology with polybutadiene as resin matrix, glass fiber cloth as reinforcement and SiO2 as filler, and the effects of SiO2 particle morphology (spherical shape and irregular shape) and particle size (2-20 μm) on the dielectric properties, bending strength, peeling strength and water absorption of copper clad laminates were studied. The results show that with the same particle size, compared with the irregular SiO2 filled hydrocarbon resin copper clad laminate, the spherical SiO2 filled hydrocarbon resin copper clad laminate had relatively low dielectric constant, dielectric loss and water absorption, relatively high bending strength and peeling strength, and relatively good comprehensive performance. With increasing particle size of SiO2, the dielectric constant, dielectric loss, bending strength and water absorption of the spherical and irregular SiO2 filled hydrocarbon resin copper clad laminate decreased, while the peeling strength increased.
中图分类号 TB332 DOI 10.11973/jxgccl202301009
所属栏目 试验研究
基金项目
收稿日期 2022/1/1
修改稿日期 2022/11/25
网络出版日期
作者单位点击查看
备注张恩宁(1996-),男,山东烟台人,硕士研究生
引用该论文: ZHANG Enning,JIN Shilei,MA Fengling,DUAN Jiazhen,LI Xiaohui. Effect of SiO2 Particle Morphology and Particle Size on Properties ofSiO2 Filled Hydrocarbon Resin Copper Clad Laminate[J]. Materials for mechancial engineering, 2023, 47(1): 65～69
张恩宁,金石磊,马峰岭,段家真,李小慧. SiO2颗粒形貌及粒径对SiO2填充碳氢树脂覆铜板性能的影响[J]. 机械工程材料, 2023, 47(1): 65～69
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参考文献
【1】ZHOU G Y, GOU X P, JIN X F, et al.Low fractal dimension modified drilling-hole wall for PTFE high-frequency board copper plating with plasma treatment[J].Journal of Applied Polymer Science, 2019, 136(42):48052.
【2】KONDO H, YOSHIDA M, KUSAMA M, et al. High performance insulating adhesive film for high-frequency applications[C]//2016 International Conference on Electronics Packaging (ICEP).[S.l.]:[s.n.], 2016.
【3】WENG L, ZHANG Y C, ZHANG X R, et al.Synthesis and properties of cyanate mixed resin systems modified by polyphenylene oxide for production of high-frequency copper clad laminates[J].Journal of Materials Science:Materials in Electronics, 2018, 29(4):2831-2840.
【4】NOTHDURFT P, RIESS G, KERN W.Copper/epoxy joints in printed circuit boards:Manufacturing and interfacial failure mechanisms[J].Materials (Basel, Switzerland), 2019, 12(3):E550.
【5】JIANG Z H, YUAN Y.Effects of particle size distribution of silica on properties of PTFE/SiO2 composites[J].Materials Research Express, 2018, 5(6):066306.
【6】ZHANG X, ZHANG Y, ZHOU Q, et al.Symmetrical "sandwich" polybutadiene film with high-frequency low dielectric constants, ultralow dielectric loss, and high adhesive strength[J].Industrial & Engineering Chemistry Research, 2020, 59(3):1142-1150.
【7】HAN K K, ZHOU J, LI Q Z, et al.Effect of filler structure on the dielectric and thermal properties of SiO2/PTFE composites[J].Journal of Materials Science:Materials in Electronics, 2020, 31(12):9196-9202.
【8】GE M N, LI Q Q, ZHANG J F, et al.Enhancing thermal conductivity of the insulating layer of high-frequency copper clad laminates via incorporating surface modified spherical hBN fillers[J].Journal of Materials Science:Materials in Electronics, 2020, 31(5):4214-4223.
【9】ZHANG T, HAN B J, YU J, et al.Enhancement of dielectric constant of polyimide by doping with modified silicon dioxide@titanium carbide nanoparticles[J].RSC Advances, 2018, 8(30):16696-16702.
【10】N S.Natural garnet reinforced high density polyethylene composites for sustainable microwave substrates[J].Materials Research Bulletin, 2018, 106:478-484.
【11】MORADI S, CALVENTUS Y, ROMÁN F, et al.Achieving high thermal conductivity in epoxy composites:Effect of boron nitride particle size and matrix-filler interface[J].Polymers, 2019, 11(7):1156.
【12】BOSE S, MAHANWAR P A.Effect of particle size of filler on properties of nylon-6[J].Journal of Minerals and Materials Characterization and Engineering, 2004, 3(1):23-31.
【13】WANG C, WEN N, ZHOU G Y, et al.Incorporation of tin on copper clad laminate to increase the interface adhesion for signal loss reduction of high-frequency PCB lamination[J].Applied Surface Science, 2017, 422:738-744.
【14】CHEN Y F, LI Z G, LIU Y L, et al.Curing mechanism and mechanical properties of Al2O3/cyanate ester-epoxy composites[J].Journal of Electronic Materials, 2020, 49(2):1473-1481.
【15】ROY K, MANDAL S K, ALAM M N, et al.Impact of surface modification on the properties of sol-gel synthesized nanotitanium dioxide (TiO2)-based styrene butadiene rubber (SBR) nanocomposites[J].Journal of Sol-Gel Science and Technology, 2016, 77(3):718-726.
【16】BOTSIS J, GMUR T, WISNOM M R, et al.Composites part A:Applied science and manufacturing[J].Composites Part A:Applied Science and Manufacturing, 2012, 43(10):1629.
【17】WANG C Y, WU B, MAO X, et al.The effects of concentration and particle size of TiO2 on the dielectric properties of polyolefin-based microwave substrates[J].Chemistry Select, 2020, 5(4):1464-1469.
【18】TANG L.Functionalized glass fibers cloth/spherical BN fillers/epoxy laminated composites with excellent thermal conductivities and electrical insulation properties[J].Composites Communications, 2019, 16:5-10.
【19】OUYANG Y G.Design of network Al2O3 spheres for significantly enhanced thermal conductivity of polymer composites[J].Composites Part A:Applied Science and Manufacturing, 2020, 128:105673.
【20】COURANT R, HILBERT D.Methods of Mathematical Physics[M].London:Wiley, 1989.
【21】DANG Z M, YUAN J K, ZHA J W, et al.Fundamentals, processes and applications of high-permittivity polymer-matrix composites[J].Progress in Materials Science, 2012, 57(4):660-723.
【2】KONDO H, YOSHIDA M, KUSAMA M, et al. High performance insulating adhesive film for high-frequency applications[C]//2016 International Conference on Electronics Packaging (ICEP).[S.l.]:[s.n.], 2016.
【3】WENG L, ZHANG Y C, ZHANG X R, et al.Synthesis and properties of cyanate mixed resin systems modified by polyphenylene oxide for production of high-frequency copper clad laminates[J].Journal of Materials Science:Materials in Electronics, 2018, 29(4):2831-2840.
【4】NOTHDURFT P, RIESS G, KERN W.Copper/epoxy joints in printed circuit boards:Manufacturing and interfacial failure mechanisms[J].Materials (Basel, Switzerland), 2019, 12(3):E550.
【5】JIANG Z H, YUAN Y.Effects of particle size distribution of silica on properties of PTFE/SiO2 composites[J].Materials Research Express, 2018, 5(6):066306.
【6】ZHANG X, ZHANG Y, ZHOU Q, et al.Symmetrical "sandwich" polybutadiene film with high-frequency low dielectric constants, ultralow dielectric loss, and high adhesive strength[J].Industrial & Engineering Chemistry Research, 2020, 59(3):1142-1150.
【7】HAN K K, ZHOU J, LI Q Z, et al.Effect of filler structure on the dielectric and thermal properties of SiO2/PTFE composites[J].Journal of Materials Science:Materials in Electronics, 2020, 31(12):9196-9202.
【8】GE M N, LI Q Q, ZHANG J F, et al.Enhancing thermal conductivity of the insulating layer of high-frequency copper clad laminates via incorporating surface modified spherical hBN fillers[J].Journal of Materials Science:Materials in Electronics, 2020, 31(5):4214-4223.
【9】ZHANG T, HAN B J, YU J, et al.Enhancement of dielectric constant of polyimide by doping with modified silicon dioxide@titanium carbide nanoparticles[J].RSC Advances, 2018, 8(30):16696-16702.
【10】N S.Natural garnet reinforced high density polyethylene composites for sustainable microwave substrates[J].Materials Research Bulletin, 2018, 106:478-484.
【11】MORADI S, CALVENTUS Y, ROMÁN F, et al.Achieving high thermal conductivity in epoxy composites:Effect of boron nitride particle size and matrix-filler interface[J].Polymers, 2019, 11(7):1156.
【12】BOSE S, MAHANWAR P A.Effect of particle size of filler on properties of nylon-6[J].Journal of Minerals and Materials Characterization and Engineering, 2004, 3(1):23-31.
【13】WANG C, WEN N, ZHOU G Y, et al.Incorporation of tin on copper clad laminate to increase the interface adhesion for signal loss reduction of high-frequency PCB lamination[J].Applied Surface Science, 2017, 422:738-744.
【14】CHEN Y F, LI Z G, LIU Y L, et al.Curing mechanism and mechanical properties of Al2O3/cyanate ester-epoxy composites[J].Journal of Electronic Materials, 2020, 49(2):1473-1481.
【15】ROY K, MANDAL S K, ALAM M N, et al.Impact of surface modification on the properties of sol-gel synthesized nanotitanium dioxide (TiO2)-based styrene butadiene rubber (SBR) nanocomposites[J].Journal of Sol-Gel Science and Technology, 2016, 77(3):718-726.
【16】BOTSIS J, GMUR T, WISNOM M R, et al.Composites part A:Applied science and manufacturing[J].Composites Part A:Applied Science and Manufacturing, 2012, 43(10):1629.
【17】WANG C Y, WU B, MAO X, et al.The effects of concentration and particle size of TiO2 on the dielectric properties of polyolefin-based microwave substrates[J].Chemistry Select, 2020, 5(4):1464-1469.
【18】TANG L.Functionalized glass fibers cloth/spherical BN fillers/epoxy laminated composites with excellent thermal conductivities and electrical insulation properties[J].Composites Communications, 2019, 16:5-10.
【19】OUYANG Y G.Design of network Al2O3 spheres for significantly enhanced thermal conductivity of polymer composites[J].Composites Part A:Applied Science and Manufacturing, 2020, 128:105673.
【20】COURANT R, HILBERT D.Methods of Mathematical Physics[M].London:Wiley, 1989.
【21】DANG Z M, YUAN J K, ZHA J W, et al.Fundamentals, processes and applications of high-permittivity polymer-matrix composites[J].Progress in Materials Science, 2012, 57(4):660-723.
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