工艺参数对石墨/铜基复合材料导电性能的影响
Effect of Process Parameters on Electrical Conductivity of Graphite/Cu Composites
摘 要
为了制备导电性能良好的石墨/铜基复合材料,研究了球磨时间、热压烧结及热挤压等工艺参数对其导电性能的影响;用扫描电镜分析了材料的拉伸断口形貌.结果表明:复合材料的导电性随球磨时间的延长和挤压温度的提高呈现先升高后降低的规律;提高挤压比和烧结温度、增加热压烧结时的压力以及延长烧结保温时间均有利于改善复合材料的导电性;球磨3 h石墨/铜复合粉经压制(压力700 MPa、保压30 s)、真空热压烧结(压力48 MPa、烧结温度600 ℃、保温1 h)和热挤压(挤压温度750 ℃、挤压比16)后,铜基体连接成连续的三维网络,且石墨均匀分布在网络之间,有效地发挥了石墨/铜基复合材料中铜的导电性.
机械球磨
热压烧结
热挤压
导电性
graphite/Cu composite
mechanical milling
hot pressed sintering
hot extrusion
electrical conductivity
Abstract
To prepare graphite/Cu composites with excellent electrical conductivity,effect of such process parameters as milling time,hot pressed sintering parameter and extrusion parameter on electrical conductivity had been investigated.Tensile fractures of the composite were also analyzed by SEM.The results show that electrical conductivity of the composites rised firstly,and then droped with lengthening the milling time and heightening the extrusion temperature.Increasing extrusion ratio and sintering temperature,raising pressure of vacuum hot pressed sintering and prolonging sintering time were all beneficial to improve electrical conductivity of the composites.By compacting under the conditions of 700 MPa and dwell time 30 s,vacuum hot pressed sintering under the conditions of 48 MPa and 600 ℃ for 1 h and hot extrusion of 3 h-milled graphite/copper composite powders,graphite evenly distributed among three-dimensional network of copper matrix in the composite,which effectively played the role of copper with good electrical conductivity.
中图分类号 TF124
所属栏目 试验研究
基金项目 哈尔滨市科技攻关计划资助项目(0111211104);中国博士后科学基金资助项目(2005038523)
收稿日期 2007/10/5
修改稿日期 2008/2/16
网络出版日期
作者单位点击查看
备注郭斌(1963-),男,黑龙江拜泉人,教授,博士.
引用该论文: GUO Bin,HU Ming,JIN Yong-ping. Effect of Process Parameters on Electrical Conductivity of Graphite/Cu Composites[J]. Materials for mechancial engineering, 2008, 32(10): 4～6
郭斌,胡明,金永平. 工艺参数对石墨/铜基复合材料导电性能的影响[J]. 机械工程材料, 2008, 32(10): 4～6
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【3】高强,吴渝英,翟宁,等.铜石墨材料导电性能研究[J].机械工程材料,2002,26(9):34-36.
【4】Beech R N,Price M S T.Copper-graphite materials in industrial carbon and graphite[M].London:Soc.Chem.Ind,1958:448-464.
【5】López G A,Mittemeijer E J.The solubility of C in solid Cu[J].Scripta Materialia,2004,51(1):1-5.
【6】Zhan Y Z,Zhang G D.Graphite and SiC hybrid particles reinforced copper composite and its tribological characteristic[J].J Mater Sci Lett,2003,22:1087-1089.
【7】Paula Q,Marcos G,Ricardo S,et al.Preparation of pitch-based carbon-copper composites for electrical applications[J].Fuel,2004,83(11/12):1625-1634.
【8】张鹏,杜云慧,曾大本,等.铜石墨复合材料的半固态铸造研究[J].复合材料学报,2002,19(1):41-45.
【9】Leong C C,Lu L,Fuh J Y H,et al.In-situ formation of copper matrix composites by laser sintering[J].Materials Science and Engineering A,2002,338:81-88.
【10】Yeoh A,Persad C,Eliezer Z.Dimensional responses of copper-graphite powder composites to sintering[J].Scripta Materialia,1997,37(3):271-277.
【11】Ivanov-Omskii V I,Lodygin A B,Yastrebov S G.Analysis of size-distribution function of metallic nanoclusters in hydrogenated amorphous carbon matrix[J].Composites Science and Technology,2003,63:1193-1196.
【12】黄锡文.电接触材料导电性探讨[J].电工合金,1998(3):26-32.
【13】Dugdale J S.金属和合金的电学性质[M].朱道康,吕世骥,译.北京:高等教育出版社,1988:248-290.
【14】金永平,郭斌,王尔德.高能球磨对3%C-Cu粉末压制特性的影响[J].中国有色金属学报,2007,17(9):1490-1494.
【15】Jin Y P,Guo B,Wang E D.High-energy ball milling of Cu-5mass%C powders[C]//Proceedings of the 1st International Conference on New Forming Technology (1st ICNFT).Harbin:[s.n],2004:639-643.
【16】金永平,郭斌,王尔德.机械球磨3wt%C-Cu复合粉末的致密化工艺研究[C]//第三届国际塑性加工先进技术研讨会.南昌:[出版者不详],2007:814-818.
【17】刘京雷.Cu-15wt%Cr粉末形变复合工艺及组织性能研究[D].哈尔滨:哈尔滨工业大学,2003.
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