- 中文核心期刊
- CSCD中国科学引文数据库来源期刊
- 中国科技核心期刊
- 中国机械工程学会材料分会会刊
| Citation: |
ZHANG Jianyu, WU Ting, LI Rongping, CHAI Shengli, LIU Wei. Influence of Cold Rolling and Annealing on Residual Stress and Mechanical Properties of Rolled Copper Foil[J]. Materials and Mechanical Engineering, 2024, 48(11): 82-88. DOI: 10.11973/jxgccl240272
|
A 150 μm-thick copper foil base metal was rolled by reversible cold rolling for four passes. The rolled copper foil with thickness of 35 μm was obtained, and was annealed at 180 °C for 1 h. The effects of cold rolling and annealing on the microstructure, surface residual stress, and mechanical properties of the rolled copper foil was studied. The results show that after cold rolling, the grain size of the copper foil was significantly refined, the average grain size was reduced to 5.7 μm, and the texture changed from annealing texture to deformation texture. After annealing, the average grain size increased to 9.4 μm and the texture was reverted to the annealing texture. After cold rolling, the surface residual stress of the copper foil increased sharply to 543.02 MPa, the hardness increased, the average flexural fatigue life was extended, the tensile strength along rolling direction (RD) was improved, and the elongation after fracture and the surface roughness of TD (transverse direction) face decreased. After annealing, the surface residual stress of the copper foil was recovered to 237.47 MPa, the hardness was reduced, the TD surface roughness slightly increased, the tensile strength decreased and elongation after fracture were slighthy improved, and the average flexural fatigue life was further extended.
| [1] |
李志宣,陈越,林洪斌,等. 无机固态电解质及其电极-电解质界面优化对全固态锂离子电池性能提高的研究进展[J]. 福建师范大学学报（自然科学版）,2021,37（1）：18-30.
LI Z X ,CHEN Y ,LIN H B ,et al. Research progress on inorganic solid electrolyte and its improvement of interface issue for all-solid-state lithium batteries[J]. Journal of Fujian Normal University（Natural Science Edition）,2021,37（1）：18-30.
|
| [2] |
LI J K ,REN X P ,LING Z ,et al. Improving bending property of copper foil by the combination of double-rolling and cross rolling[J]. Journal of Materials Research and Technology,2020,9（3）：6922-6927.
|
| [3] |
WANG W J ,LIU X F ,XIE J X. Double-coating and porous treatments and evaluation of rolled copper foil surface[J]. Surface and Coatings Technology,2014,254：284-290.
|
| [4] |
WU M Y ,LI X P ,DONG H L ,et al. High-performance flexible dielectric tunable BTS thin films prepared on copper foils[J]. Ceramics International,2019,45（13）：16270-16274.
|
| [5] |
XIA L ,LI Y ,ZHAO S ,et al. Corrosion characteristics of rolling oil on the rolled copper foil[J]. Materials,2020,13（21）：4933.
|
| [6] |
GHOSH G ,SIDPARA A ,BANDYOPADHYAY P P. Experimental and theoretical investigation into surface roughness and residual stress in magnetorheological finishing of OFHC copper[J]. Journal of Materials Processing Technology,2021,288：116899.
|
| [7] |
XIAO Z E ,CHEN J ,LIU J ,et al. Microcrystalline copper foil as a high performance collector for lithium-ion batteries[J]. Journal of Power Sources,2019,438：226973.
|
| [8] |
LI J K ,REN X P ,ZHANG Y L ,et al. Microstructural response of copper foil to a novel double-cross rolling process[J]. Journal of Materials Research and Technology,2020,9（6）：15153-15163.
|
| [9] |
龚永林. 2023年电子电路技术亮点[J]. 印制电路信息,2024,32（2）：1-6.
GONG Y L. The highlights of electronic circuit technology in 2023[J]. Printed Circuit Information,2024,32（2）：1-6.
|
| [10] |
武明伟,陈文博,李荣平,等. 加工率对压延铜箔再结晶行为的影响[J]. 热加工工艺,2019,48（1）：64-66.
WU M W ,CHEN W B ,LI R P ,et al. Influence of processing rate on recrystallization behavior of rolled copper foil[J]. Hot Working Technology,2019,48（1）：64-66.
|
| [11] |
王艳妮,靳军宝,白光祖,等. 基于专利角度的全球压延铜箔关键技术分析[J]. 电镀与涂饰,2018,37（19）：906-912.
WANG Y N ,JIN J B ,BAI G Z ,et al. Analysis on key technologies relating to rolled copper foil based on global patent applications[J]. Electroplating & Finishing,2018,37（19）：906-912.
|
| [12] |
AFIFEH M ,HOSSEINIPOUR S J ,JAMAATI R. Effect of post-annealing on the microstructure and mechanical properties of nanostructured copper[J]. Materials Science and Engineering：A,2021,802：140666.
|
| [13] |
FENG R ,ZHAO W C ,SUN Y M ,et al. Softened microstructure and properties of 12 μm thick rolled copper foil[J]. Materials,2022,15（6）：2249.
|
| [14] |
孙玉梅,宫本奎12 μm铜箔的退火组织与性能第二十三届中国覆铜板技术研讨会论文集咸阳中国电子材料行业协会覆铜板材料分会202313孙玉梅,宫本奎. 12 μm铜箔的退火组织与性能[C]//第二十三届中国覆铜板技术研讨会论文集. 咸阳：中国电子材料行业协会覆铜板材料分会,2023：13.
SUN Y M,GONG B KAnnealing organization and properties of 12 μm copper foilProceedings of the 23rd China copper Clad Laminate Technology SymposiumXianyangChina Electronic Materials Industry Association Copper Clad Laminate Materials Branch202313SUN Y M ,GONG B K. Annealing organization and properties of 12 μm copper foil[C]//Proceedings of the 23rd China copper Clad Laminate Technology Symposium. Xianyang：China Electronic Materials Industry Association Copper Clad Laminate Materials Branch,2023：13.
|
| [15] |
YANG K ,LI W Y ,YANG X W ,et al. Effect of heat treatment on the inherent anisotropy of cold sprayed copper deposits[J]. Surface and Coatings Technology,2018,350：519-530.
|
| [16] |
MAO Z N ,GU R C ,LIU F ,et al. Effect of equal channel angular pressing on the thermal-annealing-induced microstructure and texture evolution of cold-rolled copper[J]. Materials Science and Engineering：A,2016,674：186-192.
|
| [17] |
KONKOVA T ,MIRONOV S ,KORZNIKOV A ,et al. Annealing behavior of cryogenically-rolled copper[J]. Materials Science and Engineering：A,2013,585：178-189.
|
| [18] |
聂艳春,刘羽飞,胡斐斐,等. 0.5 mm半硬态C5071铜合金带材气垫炉600 ℃留底退火工艺研究[J]. 铜业工程,2023（6）：123-128.
NIE Y C ,LIU Y F ,HU F F ,et al. Bottom-leaving annealing process of 0.5 mm semi-hard C5071 copper alloy strip with air cushion annealing furnace at 600 ℃[J]. Copper Engineering,2023（6）：123-128.
|
| [19] |
HORNBOGEN E ,GAHR K H Z. Microstructure and fatigue crack growth in a γ-Fe-Ni-Al alloy[J]. Acta Metallurgica,1976,24（6）：581-592.
|
| [20] |
刘雪峰,李晶琨,汪汐涌,等. 压延铜箔轧制压下率与组织织构和耐弯折性能的关系[J]. 材料研究学报,2014,28（4）：241-247.
LIU X F ,LI J K ,WANG X Y ,et al. Relations of rolling reduction and microstructure,texture and bending property of rolled copper foils[J]. Chinese Journal of Materials Research,2014,28（4）：241-247.
|
| [21] |
SIMONS G ,WEIPPERT C ,DUAL J ,et al. Size effects in tensile testing of thin cold rolled and annealed Cu foils[J]. Materials Science and Engineering：A,2006,416（1/2）：290-299.
|
Supported by: Beijing Renhe Information Technology Co., Ltd. 
DownLoad: