Citation: | LI Liang-feng, QIU Tai, LI Xiao-yun, YANG Jian. Mechanical Alloying Preparation and Properties of 57.6Ag-22.4Cu-10.5In-9.5Sn Alloy Powders[J]. Materials and Mechanical Engineering, 2008, 32(8): 30-32. |
[1] |
王友山,史耀武,雷永平,等.无铅焊膏用松香型助焊剂活化点的研究[J].电子工艺技术,2005,26(6):311-318.
|
[2] |
刘宝权.焊锡粉技术的发展综述[J].中国金属通报,2005,23:22-24.
|
[3] |
张曙光,杨必成,杨博,等.新型超声雾化技术制备球形金属粉末[J].金属学报,2002,38(8):888-892.
|
[4] |
蒋渝,刘明,杨彦明.等离子弧流溅射法制备纳米镍粉中的氢作用机制[J].稀有金属材料与工程,2005,34(3):475-478.
|
[5] |
薛松柏,陈燕,吕晓春.Sn-Ag-Cu-Ce无铅钎料合金体系的热力学计算及预测[J].焊接学报,2005,26(5):20-22.
|
[6] |
Suryanarayana C.Mechanical alloying and milling[J].Progress in Materials Science,2001,46:1-184.
|
[7] |
FANG Fang,HE Miao.Mechanical Alloying of Ag-Cu Immiscible Alloy System[J].Journal of Shanghai Jiao tong University (Science),2006,11(1):84-87.
|
[8] |
Huang M L,Wu C M L,Lai J K L.Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying[J].Journal of Materials Science,2000,11(1):57-65.
|
[9] |
涂传政,叶建军,谭澄宇,等.Ag-Cu-In-Sn中温焊膏的性能与初步应用试验[J].热加工工艺,2006,35(19):43-45.
|
[10] |
陆佩文.无机材料科学基础[M].武汉:武汉工业大学出版社,1996.
|
[11] |
李才巨,张继东,朱心昆,等.高能球磨法制备纯铝纳米晶材料的研究[J].粉末冶金技术,2006,24(6):457-459.
|
[12] |
何纯孝.贵金属合金相图[M].北京:冶金工业出版社,1983.
|
[13] |
Massalski T B,Okamoto H,Subramanian P R,et al.Binary Phase Diagrams[M].Ohio,USA:ASM Publication,1990.
|
[14] |
Lobemeier D,Klein H,Nembach E.Grain boundary strengthening of copper-base copper-manganese and copper-gallium solid solutions[J].Acta Mater,1997,46(8):2909-2912.
|
[15] |
Lee Chin C,William W S.High temperature silver-indium joints manufactured at a low temperature[J].Thin Solid Films,2000,366(6):196-201.
|