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    ZHEN Xi-cai, SONG Yu-qiang, LI Shi-chun. DIFFUSION MECHANISM OF THE INTERFACE OF Al/Cu/Mg DIFFUSION COUPLE[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2008, 44(4): 168-171.
    Citation: ZHEN Xi-cai, SONG Yu-qiang, LI Shi-chun. DIFFUSION MECHANISM OF THE INTERFACE OF Al/Cu/Mg DIFFUSION COUPLE[J]. PHYSICAL TESTING AND CHEMICAL ANALYSIS PART A:PHYSICAL TESTING, 2008, 44(4): 168-171.

    DIFFUSION MECHANISM OF THE INTERFACE OF Al/Cu/Mg DIFFUSION COUPLE

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    • Received Date: October 27, 2007
    • The diffusion-reaction zones of Al/Cu/Mg diffusion couples made by inlaying method were researched to identify their characteric by means of back-scattered electron images of Scanning electron microscope and Electrion microprobe analysis. The results indicate that sintering temperature plays a prime role in the development of the number of phase layers. Five ternary intermetallic compounds were obtained at 450 ℃,there are Al6CuMg4,Al7Cu3Mg6,Al2CuMg,Al5Cu6Mg2 and Cu5Al3.
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