Citation: | XING Jin-zhu, LIU Bao-ting, HUO Ji-chuan, ZHOU Yang, LI Xiao-hong, LI Li, ZHANG Xiang-yi, PENG Ying-cai, WANG Xia. Ti-Al Film Used as Diffusion Barrier for Copper Interconnection Deposited by RF Magnetron Sputtering[J]. Materials and Mechanical Engineering, 2009, 33(5): 83-86. |
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