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    LIU Hong-Bin, LIU Wei, CHEN Ming, SHANG Zai-Yan, GAO Yan, HE Jin-Jiang, WANG Xin-Ping, LV Bao-Guo, JIANG Xuan. The Application of Nondestructive Testing in Sputtering Target Manufacture[J]. Nondestructive Testing, 2012, 34(7): 57-60.
    Citation: LIU Hong-Bin, LIU Wei, CHEN Ming, SHANG Zai-Yan, GAO Yan, HE Jin-Jiang, WANG Xin-Ping, LV Bao-Guo, JIANG Xuan. The Application of Nondestructive Testing in Sputtering Target Manufacture[J]. Nondestructive Testing, 2012, 34(7): 57-60.
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    The Application of Nondestructive Testing in Sputtering Target Manufacture

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    • Received Date: February 22, 2012
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      • Abstract
    • The quality requirement for the sputtering target for electronic information industry and FPD industry is strictly high. The nondestructive testing added in the processes of sputtering target manufacturing is very useful to control the qualities of sputtering targets. Radiographic testing and ultrasonic testing were used for this purpose. The nondestructive testing could not reduce the production efficiency. The discontinuities in blanks, plates and weld joints were focus of attention. Ultrasonic longitudinal wave pulse reflection C-scan technology was mainly applied. The acceptance levels were extremely rigorous.
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      • References (17)
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